The
outbreak of H9N2 avian influenza virus (H9N2 AIV) brings high mortality
and huge economic losses every year. Sensitive and reliable detection
methods are essential to timely diagnosis and treatment. Herein, a
dual-modality immunoassay is proposed for H9N2 AIV detection by employing
fluorescent-magnetic-catalytic nanospheres (FMCNs) as labels and alkaline
phosphatase (ALP)-induced metallization as a signal amplification
strategy. The excellent magnetic properties of FMCNs endow the assay
a potential application in complex samples. Also, the excellent fluorescence
properties of FMCNs enable fluorescence modality readout. The antibodies
on the FMCN surface can achieve efficient capture and separation of
targets. Amplified electrochemical modality readout can be obtained
through ALP-catalyzed silver deposition. Dual-modality immunoassay
combined the advantages of electrochemical assay with fluorescence
assay and provides accurate detection results to meet different testing
needs. With two quantitative analysis forms, H9N2 AIV can be detected
by electrochemical signals with a quantitation range of 0.1 to 1000
ng/mL and a detection limit of 10 pg/mL. The linear range is 300 to
1000 ng/mL with a detection limit of 69.8 ng/mL by the fluorescence
signal readout. Moreover, the specificity, anti-interference ability,
accuracy, and diversity of the proposal have unlimited potential for
early diagnosis of suspect infections.
A polyurethane resin catalyst with the cross-linking silver (Ag) ion is successfully synthesized in this study, and its use as a catalyst in electroless copper deposition is also analyzed. FT-IR, SEM, EDX and electrochemical open circuit potential-time (OCP-t) technique are used to analyze the structure of the catalyst, the process of catalyzing copper deposition and induced rate of the electroless copper deposition. We also demonstrate that the polyurethane resin catalyst containing silver ion can be screen printed onto the PET substrate, then, a Cu pattern is successfully fabricated on the PET after electroless copper plating.
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