A polyurethane resin catalyst with the cross-linking silver (Ag) ion is successfully synthesized in this study, and its use as a catalyst in electroless copper deposition is also analyzed. FT-IR, SEM, EDX and electrochemical open circuit potential-time (OCP-t) technique are used to analyze the structure of the catalyst, the process of catalyzing copper deposition and induced rate of the electroless copper deposition. We also demonstrate that the polyurethane resin catalyst containing silver ion can be screen printed onto the PET substrate, then, a Cu pattern is successfully fabricated on the PET after electroless copper plating.
As a simple and useful approach, vapor-phase photografting acrylic acid was used to modify the surface of PET films. Catalyst of silver nanoparticles was distributed on the photografting PET films equably after reducing by ascorbic acid. Topography of the pristine, grafting and metallized PET films was characterized by scanning electron microscope (SEM). XRD and FTIR-ATR were also used to analyze the electroless plating copper layer and the grafting PET film respectively.
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