This work presents a damage evolution framework including liquid-assisted healing. The model incorporates contributions from void size, void pressure, surface tension and liquid pressure. Experimental motivation for the damage-healing model is provided with in-situ melting experiments, where the evolution of the void distribution under monotonic tension is illustrated. The damage evolution is based on nucleation and growth of voids, which are modeled in a unified creep and plasticity framework. The proposed damage formulation introduces a void collective, which computes the void distribution in the material and allows to describe void collapse using the Rayleigh-Plesset equation. The necessary conditions for healing are discussed with use of model results. Particularly, the role of external load during healing, the dependence on liquid viscosity and surface tension are investigated.
This work provides an analysis of X-ray micro computed tomography data of Sn-xBi solders with x = 20, 30, 35, 47, 58 wt.% Bi. The eutectic thickness, fraction of eutectic and primary phase are analyzed. Furthermore, the 3D data is evaluated by means of morphology parameters, such as, shape complexity, flatness, elongation and mean intercept length tensor. The investigated alloys are categorized in three groups based on their morphology, which are described as “complex dominant”, “complex- equiaxed” and “mixed”. The mechanical behavior of Sn-Bi alloys in the semi-solid configuration and the correlation with microstructural parameters are discussed. A varying degree of geometric anisotropy of the investigated alloys is found through the mean intercept length tensor. Representative volume element models for finite element simulations (RVE-FEM) are created from tomography data of each alloy to analyze a correlation of geometric and elastic anisotropy. The simulations reveal an elastic isotropic behavior due to the small difference of elastic constants of primary and eutectic phase. A discussion of properties in the semi-solid state and liquid phase healing is provided.
This work simulates the collapse of a spherical void in pure Sn during melting using molecular dynamics (MD). Simulations were performed for two temperatures with a modified embedded atom method (MEAM) potential, which was reported to be in good agreement with respect to melting point and elastic constants. Solutions of the Rayleigh–Plesset (RP) equation are used for comparison under the assumption of macroscopic surface tension and liquid viscosity. Despite a qualitative correlation, longer collapse times were observed in MD simulations, which arose from partial solid structures and the incubation time for melting.
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