Healing solders: A numerical investigation of damage-healing experiments

Siroky, Georg; Melinc, David; Magnien, Julien; Kozeschnik, Ernst; Kieslinger, Dietmar; Kraker, Elke; Ecker, Werner

doi:10.1109/eurosime48426.2020.9152751

Cited by 3 publications

(4 citation statements)

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“…The microstructural and morphology descriptors reported in the present work allow a discussion of several mechanical properties in the semi-solid state, with the eutectic phase still being liquid [ 35 , 36 ]. Under these conditions, the residual strength of the solder joint is an important measure to estimate tolerable external forces.…”

Section: Discussionmentioning

confidence: 99%

“…Theoretical considerations of liquid-assisted healing reported in References. [ 35 , 36 ] suggest that external compressive deformation is a driving force for liquid-assisted healing. This effect is limited by the tendency of void formation under semi-solid compression, which has been investigated for Al-Cu alloys [ 54 , 55 , 56 ].…”

Section: Discussionmentioning

confidence: 99%

“…The theoretical considerations of liquid-assisted healing in References. [ 35 , 36 ] discussed the role of local material transport for void healing. It was mentioned that the local resistance against material transport will lead to a deviation of the theoretical healing efficiency.…”

Section: Discussionmentioning

confidence: 99%

“…The elasto-plastic response of Sn-Ag-Cu solders after aging was studied by Maleki et al [ 26 , 29 ] and highlighted the possibility to compute the stress-strain response from tomography data. Besides these reported studies on thermal and mechanical behavior, other properties also depend on the microstructural morphology, such as semi-solid deformation [ 30 , 31 , 32 ], hot tearing [ 33 , 34 ] or liquid phase healing [ 35 , 36 ]. These properties have not been reported in literature for Sn-Bi alloys and it is the aim of the present work to provide the essential parameters to enable such studies.…”

Section: Introductionmentioning

confidence: 99%

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Analysis of Sn-Bi Solders: X-ray Micro Computed Tomography Imaging and Microstructure Characterization in Relation to Properties and Liquid Phase Healing Potential

et al. 2020

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This work provides an analysis of X-ray micro computed tomography data of Sn-xBi solders with x = 20, 30, 35, 47, 58 wt.% Bi. The eutectic thickness, fraction of eutectic and primary phase are analyzed. Furthermore, the 3D data is evaluated by means of morphology parameters, such as, shape complexity, flatness, elongation and mean intercept length tensor. The investigated alloys are categorized in three groups based on their morphology, which are described as “complex dominant”, “complex- equiaxed” and “mixed”. The mechanical behavior of Sn-Bi alloys in the semi-solid configuration and the correlation with microstructural parameters are discussed. A varying degree of geometric anisotropy of the investigated alloys is found through the mean intercept length tensor. Representative volume element models for finite element simulations (RVE-FEM) are created from tomography data of each alloy to analyze a correlation of geometric and elastic anisotropy. The simulations reveal an elastic isotropic behavior due to the small difference of elastic constants of primary and eutectic phase. A discussion of properties in the semi-solid state and liquid phase healing is provided.

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Section: Discussionmentioning

confidence: 99%