This paper presents an experimentally verified analytical model of temperature-dependent yield effects on the curvatures of composite beam structures used in complementary metal-oxide semiconductor microelectromechanical systems (CMOS MEMS). The temperature-dependent effects on composite beam curvatures of a thermal process can be predicted by extracting key parameters from the measured curvatures of a limited number of CMOS MEMS composite-layer combinations. The effects due to thermal history in MEMS packaging, which change the characteristics of beam curvatures due to material yield, are further analyzed. The models are verified with measured results from beam structures fabricated by an application-specific integrated circuit-compatible 0.18 μm 1P6M CMOS MEMS process using a white light interferometer. These models can be applied in electronic design automation tools to provide good prediction of temperature-dependent properties related to CMOS MEMS beam curvature, such as sensing capacitance, for monolithic sensor system on chip design.
A monolithic accelerometer design with zero-g calibration with TSMC 0.18 μm mixed-signal 1P6M process is presented. On-chip digital offset calibration enables compensation of random mechanical offset in the sensor due to process variation. The maximum 21 fF capacitance mismatch can be calibrated. The simulation results show that the whole system have 452.1 mV/g sensitivity. The power consumption is about 1.16 mW. The output noise is 26.85 μg/√Hz at 1KHz.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.