This paper presents two different novel methods to manufacture optimized cavity structures, which are suitable for multilayer System-in-Package (SiP) and Multi-Chip-Module (MCM) applications, in the new low temperature cofired ceramic (LTCC) material Du Pont 9k7. In contrast to standard manufacturing, the improved DP 9k7 cavities show almost perfectly orthogonal cross sections and straight edges, achieved by applying special cavity inlays or cast silicone. Ball-wedge bond wires and wedge-wedge ribbons are implemented directly to the cavity rim successfully.
Therefore, these cavities are suitable for very short bond wires in complex RF systems and the introduced techniques are very promising for future applications using DP 9k7.
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