ASML's NXE platform is a multi-generation TWINSCAN™ platform using an exposure wavelength of 13.5nm, featuring a plasma source, all-reflective optics, and dual stages operating in vacuum. The NXE:3100 is the first product of this NXE platform. With a 0.25 NA projection optics, a planned throughput of 60 wafers/hr and dedicated chuck overlay of 4 nm, the NXE:3100 is targeted for extreme ultraviolet lithography (EUVL) implementation at 27nm halfpitch (hp) and below. The next generation NXE tools utilize a 0.33NA lens and include off-axis illumination for high volume manufacturing at a resolution down to 16nm hp and a targeted throughput of >100 wafers/hr. We share details of the performance of the 0.25NA lithography products in terms of imaging, overlay, throughput, and defectivity. We will show that we have met the required imaging performance associated with the 27nm hp node. We will also include a summary of the EUV source development, which is a key enabler for cost-effective introduction of EUVL into highvolume manufacturing. Finally, we will highlight some of the technical changes we introduced to enable the transition from 27 to 22nm lithographic performance while introducing our 0.33NA Step & Scan system, the NXE:3300B.
The continuing reduction of IC device dimensions puts stringent demands on the corresponding overlay performance. As part of the total overlay budget, the effects of the different process parameters need to be characterized and well understood. In a joint development program between IMEC and ASML, the robustness of different alignment strategies to process parameters has been evaluated using the ATHENA alignment system. This paper looks at both Front-end (Shallow Trench Isolation) and Back-end (W-CMP and copper dual damascene) processing.To investigate the effect of STI processing on alignment marks in Front-end processing an extensive evaluation has been performed in which both mark design and process parameters have been varied. The robustness to typical long term process variation at the STI CMP step in a production environment has also been evaluated.To improve the robustness of alignment marks in Back-end processing, new mark designs have been evaluated. These designs have been evaluated for two different processes. The first uses traditional W-CMP and sputtered aluminum. The second uses copper dual damascene, with layer stacks consisting of both conventional and low-k dielectric materials. This knowledge will be used to generate alignment strategies for future technology nodes.
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