Aloi pateri bebas plumbum telah digunakan secara meluas sebagai bahan antarasambungan bagi peranti elektronik yang memberikan sambungan elektrik bagi kebolehfungsian dan sokongan mekanik bagi integriti struktur. Rawatan termomekanik merupakan proses metalurgi yang melibatkan gabungan rawatan terma dan pembebanan mekanik. Kajian ini bertujuan untuk mengkaji kesan rawatan termomekanik dengan mampatan tunggal ke atas perubahan mikrostruktur dan sifat mikromekanik aloi pateri Sn-0.7Cu. Aloi pateri Sn-0.7Cu berbentuk bar dipotong kepada lapan sampel berbentuk kiub dengan ukuran 6 mm (p) × 6 mm (l) × 10 mm (t). Empat sampel yang pertama menjalani rawatan haba pada suhu 30 ℃, 60 ℃, 90 ℃ dan 120 ℃ selama 20 minit, diikuti dengan proses mampatan tunggal sebanyak 20% dan pelindapan di dalam medium air. Empat sampel yang berikutnya hanya didedahkan pada rawatan haba sahaja, diikuti pelindapan di dalam medium air digunakan sebagai sampel kawalan. Cerapan mikrostruktur menunjukkan butiran yang kecil dan seragam aloi pateri Sn-0.7Cu terbentuk dengan rawatan termomekanik mampatan tunggal pada suhu 120 °C akibat daripada penghabluran semula butiran. Keputusan kekerasan bagi aloi pateri Sn-0.7Cu selepas rawatan termomekanik mampatan tunggal pada suhu 120 °C telah menunjukkan perubahan yang sedikit iaitu sebanyak 19% berbanding sampel rawatan haba sebanyak 64%. Keputusan modulus terkurang juga menunjukkan tren yang sama iaitu perubahan yang lebih rendah bagi sampel dengan rawatan termomekanik mampatan tunggal pada suhu 120 °C sebanyak 52% manakala sampel rawatan haba sebanyak 69%. Penemuan kajian ini menunjukkan bahawa kesan suhu dalam rawatan termomekanik mampatan tunggal berupaya untuk mengubah suai mikrostruktur dan memberikan kestabilan sifat mikromekanik aloi pateri Sn-0.7Cu berbanding dengan rawatan haba.
The relationship between a process and mechanical properties are important in understanding the behaviour of a material under certain conditions. This indicate that mechanical properties of the materials can be modified through certain processing. Hence, this paper investigates the effect of 60% thickness reduction of Sn-Cu alloy in thermomechanical treatment on the localized micromechanical properties. A bar-shape of Sn-Cu solder alloy is subjected to heat treatment at 30°C, 60°C, 90°C, 120°C and 150°C for 20 minutes, followed by 60% thickness reduction via compression process. Sample without compression process was used as control sample. Nanoindentation approach was used to characterize the localized micromechanical properties of the samples. The results show the hardness value for control samples reduced approximately 56%, from 181 MPa at 30°C to 79 MPa at 150°C. Reduced modulus of control sample has shown similar decreasing trend from 149 GPa at 30°C to 85 GPa at 150°C, approximately 43% changes. Lower changes in hardness and reduced modulus observed for thermomechanical treated sample approximately 20% and 18%, respectively. These findings show that thermomechanical treatment has given significant effect on the localized micromechanical properties of Sn-Cu solder alloy.
Solders are used in electronic packaging for metallurgical interconnections. Thermomechanical methods are used to modify the properties of a material. Cubic Sn-0.7Cu solder alloy was subjected to heat treatment at 30–150 °C for 20 min, followed by 80 % compression. The control samples used in this study were only subjected to heat treatment. This study used the nanoindentation approach to investigate the reductions in the modulus and hardness of the lead-free Sn-0.7Cu solder alloy after thermomechanical treatment. Samples with 80 % compression showed slight changes in the reduced modulus (approximately 24 %) and hardness (approximately 14 %) after thermomechanical treatment. In contrast, the solder alloy that underwent heat treatment alone (the control sample) showed shifts in the hardness and reduced modulus of approximately 54 % and 66 %, respectively. The production of new recrystallized grains resulted in smaller changes in the micromechanical properties. These findings demonstrated that thermomechanical treatment can both modify and stabilize the properties of the Sn-0.7Cu solder alloy, such as micromechanical properties.
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