The shielded potential and the energy loss of N2 projectiles propagating through a multicomponent dusty plasma are studied. Analytically general expressions have been obtained for the potential and for the energy loss, taking into account the two-body correlation effects. However, numerical calculations have been performed for one, three, and six projectiles, incorporating interference between two consecutive projectiles. It is found that the correlation effect causes distortion in the potential profile depending upon the separation between the two projectiles. The distortion becomes pronounced for separation smaller than the Debye length.
We report on diffusion behavior for ion implanted indium and silver atoms in ZnO crystals. Both In and Ag ions were implanted at room temperature at 7-10° relative to c-axis to avoid channeling effects during implantation. In ions were implanted at four different energies (40, 100, 200, and 350 keV, respectively) and doses (4.20×1013, 6.70×1013, 8.10×1013 and 3.10×1014 /cm2, respectively), resulting in a total dose of 5 ×1014 /cm2. For another set of ZnO samples, Ag ions were implanted at energies 30, 75, 150, and 350 keV at doses 3.3×1013, 4.2×1013, 8.3×1013 and 3.4×1014 /cm2, respectively, to reach a total dose of 5×1014 /cm2. Both In and Ag implants resulted in a uniform concentration profile of the implanted dopants from surface to depth ~ 150 nm. The samples were annealed for 30 minutes at temperatures between 850-1050 °C in an oxygen gas flow. The distributions of In and Ag atoms, either aligned or nonaligned along the crystalline directions, were measured by Rutherford backscattering combined with ion channeling. The diffusivities for nonaligned (interstitial) and aligned (substitutional) dopants atoms were determined to vary with annealing temperature via the Arrhenius relationship. The diffusion activation energies (Ea) along the <10-11> direction for substitutional impurity atoms were lower than those for interstitial dopants atoms e.g., in the case of In, Ea ~ 1.52 eV for <10-11> aligned In atoms and Ea ~ 2.61 eV for interstitial In atoms between <10-11> atomic rows and in the case of Ag, Ea ~ 1.77 eV for the interstitial Ag atoms between the <10-11> atomic rows and 1.11 eV for <10-11> aligned Ag atoms. The diffusion activation energies showed a different trend for the two dopants as measured along the <0001> crystalline direction. For Ag implanted in ZnO, the activation energy of Ea ~ 0.91 eV for the aligned Ag atoms along <0001> direction and Ea ~ 1.55 eV were found for the interstitial Ag atoms, whereas in the case of In along the <0001> direction, the interstitial In was found to migrate with a higher activation energy (Ea ~ 1.78 eV) than the substitutional In (Ea ~1.42 eV). These results will be compared with first-principle calculations for understanding the energetics of defect formation and migration in both n- and p-type doping cases.
We have made an investigation of the surface oxide effects on nanocavity formation in hydrogen implanted silicon and the influence of resultant nanocavities on diffusion and gettering of implanted silver atoms. A wafer with a 200-nm SiO2 surface layer was implanted with 22.5 keV H ions to a dose of 1 × 1017 cm−2, yielding the concentration peak of implanted H ions at ∼140 nm below the SiO2/Si interface. Subsequently, two sets of Si samples were prepared, depending on whether the oxide layer was etched off before (Group-A) or after (Group-B) post-H-implantation annealing. As evidenced by transmission electron microscopy, Group-A samples exhibited an array of large-sized nanocavities in hexagon-like shape, extending from the surface to the depth ∼140 nm, whereas a narrow band of sphere-shaped nanocavities of small size was present around 140 nm below the surface in Group-B samples. These Si samples with pre-existing nanocavities were further implanted with Ag ions in the surface region (∼40 nm projected range) and post-Ag-implantation annealing was conducted in the temperature range between 600 and 900 °C. Measurements based on Rutherford backscattering spectroscopy revealed much different behaviors for Ag redistribution and defect accumulation in these two sets of samples. Compared to the case for Group-B Si, Group-A Si exhibited a lower concentration of residual defects and a slower kinetics in Ag diffusion as well. We discuss the role of thick surface oxide in point defect generation and recombination, and the consequence on nanocavity formation and defect retention in Si. The properties of nanocavities, e.g., their depth distribution, size, and even shape, are believed to be responsible for the observed disparities between these samples, including an interesting contrast of surface vs. bulk diffusion phenomena for implanted Ag atoms.
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