. Performance analysis and optimization of high density tree-based 3d multilevel FPGA. Abstract. A novel 3D Tree-based Multilevel FPGA architecture that unifies two unidirectional programmable interconnection network is presented in this paper. In a Tree based architecture, the interconnects are arranged in a multilevel network with the logic blocks placed at different Tree levels using ButterflyFat-Tree network topology. 2D physical layout development of a Tree-based multilevel interconnect network is a major challenge for Tree-based FPGA. A 3D interconnect network technology leverage on Through Silicon Via (TSVs) to redistribute the Tree interconnects, based on network delay and thermal considerations into multiple silicon layers discussed. The impact of of Through Silicon Vias and performance improvement on 3D Tree-based FPGA analyzed and also an optimized physical design technology leveraging on TSV, Thermal-TSV (TTSV), and thermal analysis are presented. Compared to 3D Mesh-based FPGA, the 3D Tree-based FPGA design reduces the number of TSVs by 29% and a performance improvement of 53% recorded in our place and route experiments.

In this paper, we propose the implementation of multiple defect-tolerant techniques on an SRAM-based FPGA. These techniques include redundancy at both the logic block and intra-cluster interconnect. In the logic block, redundancy is implemented at the multiplexer level. Its efficiency is analyzed by injecting a single defect at the output of a multiplexer, considering all possible locations and input combinations. While at the interconnect level, fine grain redundancy is introduced which not only bypasses defects but also increases routability. Taking advantage of the sparse intra-cluster interconnect structures, routability is further improved by efficient distribution of feedback paths allowing more flexibility in the connections among logic blocks. Emulation results show a significant improvement of about 15% and 34% in the robustness of logic block and intracluster interconnect respectively. Furthermore, the impact of these hardening schemes on the testability of the FPGA cluster for manufacturing defects is also investigated in terms of maximum achievable fault coverage and the respective cost.

This paper presents an improved cluster-based Mesh architecture. This architecture has a depopulated intracluster interconnect, and presents a new hierarchical topology for the switch box which unifies a downward and an upward unidirectional networks. Experimental results of 20 MCNC benchmarks show that density is improved and interconnect area requirement is reduced by 42% compared to the cluster-based VPR architecture.

No abstract

The wave dynamic differential logic (WDDL) has been identified as a promising countermeasure to increase the robustness of cryptographic devices against differential power attacks (DPA). However, to guarantee the effectiveness of WDDL technique, the routing in both the direct and complementary paths must be balanced. This paper tackles the problem of unbalance of dual-railsignals in WDDL design. We describe placement techniques suitable for tree-based and mesh-based FPGAs and quantify the gain they confer. Then, we introduce a timing-balance-driven routing algorithm which is architecture independent. Our placement and routing techniques proved to be very promising. In fact, they achieve a gain of 95%, 93%, and 85% in delay balance in tree-based, simple mesh, and cluster-based mesh architectures, respectively. To reduce further the switch and delay unbalance in Mesh architecture, we propose a differential pair routing algorithm that is specific to cluster-based mesh architecture. It achieves perfectly balanced routed signals in terms of wire length and switch number.

An innovative 3D physical design exploration methodology for Tree-based FPGA architecture is presented in this paper. In a Tree-based FPGA architecture, the interconnects are arranged in a mult-dimensional network with the logic unites and switch blocks placed at different levels, using a Butterfly-Fat Tree network topology. A 3D physical design exploration methodology leverage on Through Silicon Via (TSVs) using a horizontal break-point to re-distribute the Tree interconnects into multiple stacked active silicon layers proposed in this paper.

No abstract

No abstract