A new simulation technique is proposed in order to evaluate the thermo-mechanical response of thin film layer attached or jointed to substrate. A thermo-elasto-plastic finite element analysis is carried out on a jointed system while only the film layer is picked up and a deformation analysis is in parallel implemented with reference to the data obtained in the analysis on the jointed body. This approach enables us to capture the mechanical stiffness of the thin film layer considered as an independent body. The effects of crystal morphology of substrate and the surface roughness of interface are discussed on the inhomogeneity force evolution, the out-of-plane deformation and the buckling of thin film layer.
In order to clarify the mechanical state at the interface between substrate and coating material, numerical analyses are implemented on model materials under thermal loads, and the possibilities of debonding are discussed from the configurational mechanics concept. The intensity of the interfacial singularity can be discussed in relation to the inhomogeneity force which is numerically evaluated in the course of thermal loading via finite element analysis. It is shown that interfacial roughness, a small perturbation at the interface, may have a dominant role in the evolution of inhomogeneity. Effects of initial defects, temperature gradient and additional external load are also evaluated. It is confirmed that the inhomogeneity force is a generalisation of the J-integral, i.e. the energy release rate in fracture mechanics, and this is also applicable to interfacial problems. A possible scenario of layer debonding is discussed in terms of the material inhomogeneity and the deformation characteristics of the thin coating layer under thermal loading.
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