Thermo-mechanical Response and Onset of Instability of Thin Film Layer Due to Thermal Loading

Abstract

A new simulation technique is proposed in order to evaluate the thermo-mechanical response of thin film layer attached or jointed to substrate. A thermo-elasto-plastic finite element analysis is carried out on a jointed system while only the film layer is picked up and a deformation analysis is in parallel implemented with reference to the data obtained in the analysis on the jointed body. This approach enables us to capture the mechanical stiffness of the thin film layer considered as an independent body. The effects of crystal morphology of substrate and the surface roughness of interface are discussed on the inhomogeneity force evolution, the out-of-plane deformation and the buckling of thin film layer.