The Institute's overall goal is to strengthen and advance the Nation's science and technology and facilitate their effective application for public benefit. To this end, the Institute conducts research to assure international competitiveness and leadership of U.S. industry, science and technology. NIST work involves development and transfer of measurements, standards and related science and technology, in support of continually improving U.S. productivity, product quality and reliability, innovation and underlying science and engineering.
Commercial packaging roadmaps clearly depict the imminence of chip stacking utilizing through silicon via (TSV) technology (commonly referred to as 3-dimensional integrated circuits (3DIC)) as a means to improve system performance by reducing routing lengths, latency, and drive power while increasing functionality per unit volume. Roadmaps and packaging research focus areas also depict complex 3DIC and packaging architecture concepts to include heterogeneous materials, components and features [1][2]. This added diversity often exacerbates physical proximity effects such as thermal and electromagnetic (EM) coupling. To reduce unwanted thermal and EM coupling, we propose interleaving 25µm thick, flexible, high thermal conductivity (1600 W/m·K, in-plane) pyrolytic graphite sheets (PGS) [3] into 3DIC stacks. The PGS provides passive parallel thermal paths from each die to the package heat spreader with potential significant reduction in overall package thermal resistance ( JC ). This also provides design flexibility to thermally decouple sensitive components within the package from intermittent power sources by thermal routing. Interleaving PGS is also expected to impart EM shielding benefits between die and serve to reduce overall package emissions. This paper focuses on potential junction-to-case thermal resistance improvements of a Thermally Enhanced 3-Dimensional Integrated Circuit (TE3DIC) packaging solution. By utilizing a path-finding set of thermal models of a TE3DIC BGA package, design parameters are adjusted to assess various cases, promote design intuition, and ultimately lead to a final test vehicle design. This test vehicle includes three TSV die with both uniform and localized (fireball) Ni80Cr20 heater traces and include resistive platinum temperature sensors. These die are copper pillar bonded with PGS interleaved and flip chip soldered to a 37mm BGA carrier. The perimeter of the PGS is bonded to a terraced copper heat spreader. Detailed modeling estimates a 44% reduction in package thermal resistance with PGS interleaves in a three die stack compared with a similar direct bonded die stack. Reductions are greater for 3DIC designs with copper pillar bonding compared to covalently bonded die stacks.
INTRODUCTION TO JULY 1988 ISSUE OF THE CEEE TECHNICAL PROGRESS BULLETIN This is the twenty-second issue of a quarterly publication providing information on the technical work of the National Bureau of Standards Center for Electronics and Electrical Engineering. This issue of the CEEE Technical Progress Bulletin covers the first quarter of calendar year 1988. Organization of Bulletin: This issue contains abstracts for all Center papers released for publication by NBS in the quarter and citations and abstracts for Center papers published in the quarter. Entries are arranged by technical topic as identified in the table of contents and alphabetically by first author under each subheading within each topic. Unpublished papers appear under the subheading "Released for Publication". Papers published in the quarter appear under the subheading "Recently Published". Following each abstract is the name and telephone number of the individual to contact for more information on the topic (usually the first author). This issue also includes a calendar of Center conferences and workshops planned for calendar year 1988 and a list of sponsors of the work. Center for Electronics and Electrical Engineering: Center programs provide national reference standards, measurement methods, supporting theory and data, and traceability to national standards. The metrological products of these programs aid economic growth by promoting equity and efficiency in the marketplace, by removing metrological barriers to improved productivity and innovation, by increasing U. S. competitiveness in international markets through facilitation of compliance with international agreements, and by providing technical bases for the development of voluntary standards for domestic and international trade. These metrological products also aid in the development of rational regulatory policy and promote efficient functioning of technical programs of the Government .
INTRODUCTION TO DECEMBER 1985 ISSUE OF THE CEEE TECHNICAL PROGRESS BULLETIN This is the eleventh issue of a quarterly publication providing information on the technical work of the National Bureau of Standards Center for Electronics and Electrical Engineering. This issue of the CEEE Technical Progress Bulletin covers the second quarter of calendar year 1985. Organization of Bulletin : This issue contains abstracts for all Center papers released for publication by NBS in the quarter and citations and abstracts for Center papers published in the quarter. Entries are arranged by technical topic as identified in the table of contents and alphabetically by first author under each subheading within each topic. Unpublished papers appear under the subheading "Released for Publication". Papers published in the quarter appear under the subheading "Recently Published". Following each abstract is the telephone number of the individual to contact for more information on the topic; unless otherwise noted, this person is the first author. This issue also includes a calendar of Center conferences and workshops now planned for fiscal year 1986, an announcement of recently issued standard reference materials, and a list of sponsors of the work. Center for Electronics and Electrical Engineering : Center programs provide national reference standards, measurement methods, supporting theory and data, and traceability to national standards. The metrological products of these programs aid economic growth by promoting equity and efficiency in the marketplace, by removing metrological barriers to improved productivity and innovation, by increasing U. S. competitiveness in international markets through facilitation of compliance with international agreements, and by providing technical bases for the development of voluntary standards for domestic and international trade. These metrological products also aid in the development of rational regulatory policy and promote efficient functioning of technical programs of the Government. The work of the Center is divided into two major programs: the Semiconductor Technology Program, carried out by the Semiconductor Electronics Division (formerly the Semiconductor Materials and Processes and Semiconductor Devices and Circuits Divisions) in Gaithersburg, MD, and the Signals and Systems Metrology Program, carried out oy tne Electrosystems Division in Gaithersburg and the Electromagnetic Fields and Electromagnetic Technology Divisions in Boulder, CO. Key contacts in the Center are given on the back cover; readers are encouraged to contact any of these individuals tor further information. To request a subscription or for more information on the Bulletin , write to CEEE Technical Progress Bulletin, National Bureau of Standards,
INTRODUCTION TO MAY 1987 ISSUE OF THE CEEE TECHNICAL PROGRESS BULLETIN This is the fifteenth issue of a quarterly publication providing information on the technical work of the National Bureau of Standards Center for Electronics and Electrical Engineering. This issue of the CEEE Technical Progress Bulletin covers the second quarter of calendar year 1986. Organization of Bulletin : This issue contains abstracts for all Center papers released for publication by NBS in the quarter and citations and abstracts for Center papers published in the quarter. Entries are arranged by technical topic as identified in the table of contents and alphabetically by first author under each subheading within each topic. Unpublished papers appear under the subheading "Released for Publication". Papers published in the quarter appear under the subheading "Recently Published". Following each abstract is the name and telephone number of the individual to contact for more information on the topic (usually the first author). This issue also includes a calendar of Center conferences and workshops planned for calendar year 1987 and a list of sponsors of the work. Center for Electronics and Electrical Engineering ; Center programs provide national reference standards, measurement methods, supporting theory and data, and traceability to national standards. The metrological products of these programs aid economic growth by promoting equity and efficiency in the marketplace, by removing metrological barriers to improved productivity and innovation, by increasing U. S. competitiveness in international markets through facilitation of compliance with international agreements, and by providing technical bases for the development of voluntary standards for domestic and international trade. These metrological products also aid in the development of rational regulatory policy and promote efficient functioning of technical programs of the Government.
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