Measuring population health with morbidity and mortality data, often collected at the site of care, fails to capture the individual's perspective on health and well-being. Because health happens outside the walls of medical facilities, a holistic and singular measure of health that can easily be captured for an entire population could aid in understanding the well-being of communities. This paper postulates that Healthy Days, a health-related quality of life measure developed and validated by the Centers for Disease Control and Prevention, is an ideal survey instrument to advance population health. A systematic literature review was conducted and revealed a strong evidence base using Healthy Days with significant correlations to chronic disease conditions. Building on the literature base and experience, methods for analyzing Healthy Days data are discussed, including stratified sampling techniques, statistical measures to account for variance, and modeling techniques for skewed distributions. Using such analytic techniques, Healthy Days has been used extensively in national health surveillance. As the health care system faces increasing costs and constrained resources, the Healthy Days survey instrument can be used to inform public policies and allocate health service resources. Because Healthy Days captures broad dimensions of health from the individual's perspective, it is a simple way to holistically measure the health and well-being of a population and its trend over time. Expanded use of Healthy Days can aid population health managers and contribute to the understanding of the broader determinants of the nation's and individual community's health and aid in evaluating progress toward health goals.
A methodology for optimizing the design of an electrical packaging system for a high speed computer is described. The pertinent parameters are first defined and their sensitivities are derived so that the proper design trade-offs can ultimately he made. From this procedure, a set of rules is generated for driving a computer aided design system. Finally, there is a discussion of design optimization and circuit and package effects on machine performance.
Abstract-Throughout its history, from the early four-circuit gate-array chips of the late 1960s to today's billion-transistor multichip module, IBM has invested in tools to support its leading-edge technology and high-performance product development. The combination of demanding designs and close cooperation among product, technology, and tool development has given rise to many innovations in the electronic design automation (EDA) area and provided IBM with a significant competitive advantage. This paper highlights IBM's contributions over the last four decades and presents a view of the future, where the best methods of multimillion gate ASIC and gigahertz microprocessor design are converged to enable highly productive system-on-a-chip designs that include widely diverse hardware and software components.
The semiconductor industry expects the performance of microprocessors to continue at its current rate of improvement; i.e., clock rates should double every two to three years. This is a commendable goal but it is also fair to question whether this is an achievable goal. The fundamental problem is that as groundrules are reduced, the natural tendency is to make smaller conductor cross-sectional areas. The result is a high resistance line that exhibits slow wave propagation effects [1]. This reduces the general performance expectations. As circuits become faster and denser on the chip, line delays become greater than expected. This problem will be analyzed and potential chip and packaging solutions will be offered. Clock rate predictions for various design and process options will be made. A tactical recommendation to consider a total packaged electronics solution is presented.Index Terms-High clock rate, high performance, large chip, large die, long line, lossy line, MCM, microprocessor, multichip module, submicron design.
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