The effects of various parameters in copper electroplating electrolyte on the filling characteristics of through silicon via(TSVs). Among the various parameters, the concentration of dissolved oxygen was found to be susceptible to bottom-up filling rate. The concentration of dissolved oxygen was effectively lowered by installing the hardware named 'degasser' at the circulation line. The installation of 'degasser' enabled the maintenance of stable bottom-up filling rates for the defect-free filling of TSVs.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.