The advent of modern electronic technology lead to miniaturization and high power density of electronic devices, then the existing electronic cooling techniques cannot be used, directly affecting the performance, cost, and reliability of electronic devices. Thus, the thermal management of electronic packaging has become a key technique in many products. Passive heat transfer devices can be a good alternative to the stabilization of electronic devices temperature. In this research, an experimental evaluation of the thermal performance of four different passive devices was accomplished. The considered devices were a rod, a thermosyphon, a heat pipe with a metal screen as the capillary structure, and a heat pipe with microgrooves. The heat pipe is a highly efficient device that carries large amounts of power with a small temperature difference. The heat pipe consists of the involucre, the working fluid, and the capillary structure. The thermosyphon is a kind of heat pipe assisted by gravity. In other words, it has no wick structure to return the working fluid. The devices were made of copper with a total length of 200 mm and an outer diameter of 9.45 mm. The thermosyphon and the heat pipes used deionized water as working fluid with a filling ratio of 60% of the evaporator volume. The devices were tested in vertical and horizontal positions under thermal loads between 5 W and 45 W. All the devices have operated satisfactorily when tested in accordance with the behavior of the thermal resistance. The heat pipes were the best among the tested devices and the best position was vertical.
Original scientific paper https://doi.org/10.2298/TSCI180227206BThis work presents the use of electrical discharge machining (EDM) technology for manufacturing of three different types of axial microgrooves in heat pipes. This specific process, called wire electrical discharge machining (wire-EDM), allows the fabrication of microgrooves on the inner wall of a heat pipe with accuracy. Different from other capillary structures, such as composite wick and screen mesh, the material is removed from the pipe's container in order to conceive the capillary structure, which contributes with the mass reduction of the passive two-phase heat transfer device. The heat pipes were manufactured from a straight copper pipe with the external diameter of 9.45 mm, the inner diameter of 6.20 mm, and a total length of 200 mm. Three types of axial microgrooves were manufactured for constant width (35 μm) and varying the depth (from 30-48 μm), and thickness (from 35-70 μm). The number of microgrooves was also varied from 21-32 microgrooves. Water was used as the working fluid and the loading filling ratio was 60% of the evaporator volume. The condenser was cooled by air forced convection, the adiabatic section was insulated and the evaporator was heated by an electrical resistor and it was insulated from the environment with aeronautic thermal insulation. The thermal performance of the heat pipes are analyzed based on experimental results, so the heat pipes were tested at the horizontal and different inclinations under different low heat loads (from 5-50 W or a heat flux from 0.21-2.10 W/cm 2 ). The experimental results showed that the axial microgrooves manufactured by the wire-EDM process worked satisfactorily in all analyzed cases and microgrooves of Type 1 showed a better thermal performance when compared with the others.
The thermosyphon is a type of heat exchanger that has been widely used in many applications. The use of thermosyphons has been intensified in recent years, mainly in the manufacture of solar collectors and various industrial activities. A thermosyphon is a vertical sealed tube filled with a working fluid, consisting of, from bottom to top, by an evaporator, an adiabatic section, and a condenser. The study of geyser-boiling phenomena, which occurs inside the thermosyphon is of extreme importance, therefore the experimental analysis of the parameters related to the two-phase flow (liquid-steam), such as void fraction, bubble frequency, bubble velocity, and bubble length are necessary, since these parameters have a significant influence on heat transfer. In this work, a pair of wire mesh sensors was used, a relative innovative technology to obtain experimental values of the reported quantities for measuring these parameters of slug flow in thermosyphons. An experimental setup is assembled and the sensors are coupled to the thermosyphon enabling the development of the experimental procedure. Here is presented an experimental study of a glass thermosyphon instrumented with two Wire-Mesh Sensors, in which the aforementioned slug flow hydrodynamic parameters inherent to the geyser type boiling process are measured. It was measured successfully, as a function of the heat load (110, 120, 130, 140, and 150W), the void fraction (instantly and average), liquid film thickness, translation velocity of the elongated bubbles, lengths of the bubbles, and the liquid slug (displaced by the bubble rise up). It was observed that the higher the heat load, the lower is the bubble translation velocity. For all heat loads, based on the measured length of liquid slug (consequent displacement of liquid volume), caused by bubbles rise from evaporator to condenser, it could be affirmed to some extent that both boiling regime (pool and film) exist in the evaporator. The measured average void fraction (80%) and liquid film thickness (around 2.5mm) during the elongated bubble passages were approximately constant and independent of the heat load.
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