Thermal performance evaluation of different passive devices for electronics cooling

Abstract

The advent of modern electronic technology lead to miniaturization and high power density of electronic devices, then the existing electronic cooling techniques cannot be used, directly affecting the performance, cost, and reliability of electronic devices. Thus, the thermal management of electronic packaging has become a key technique in many products. Passive heat transfer devices can be a good alternative to the stabilization of electronic devices temperature. In this research, an experimental evaluation of the thermal performance of four different passive devices was accomplished. The considered devices were a rod, a thermosyphon, a heat pipe with a metal screen as the capillary structure, and a heat pipe with microgrooves. The heat pipe is a highly efficient device that carries large amounts of power with a small temperature difference. The heat pipe consists of the involucre, the working fluid, and the capillary structure. The thermosyphon is a kind of heat pipe assisted by gravity. In other words, it has no wick structure to return the working fluid. The devices were made of copper with a total length of 200 mm and an outer diameter of 9.45 mm. The thermosyphon and the heat pipes used deionized water as working fluid with a filling ratio of 60% of the evaporator volume. The devices were tested in vertical and horizontal positions under thermal loads between 5 W and 45 W. All the devices have operated satisfactorily when tested in accordance with the behavior of the thermal resistance. The heat pipes were the best among the tested devices and the best position was vertical.

Thermal applications of hybrid phase change materials: A critical review

“…Other methods to increase the thermal conductivity and thermal storage capacity of PCM involve the use of heat pipes [84,85], extended surfaces, micro-and macro-encapsulation and addition of nanoparticles having high thermal conductivity [86,87]. These nanoparticles when added to the base PCM, enhance its thermal characteristics.…”

Thermal Analysis of a Finned Thermosyphon for Heat Exchanger Applications

“…Figure 9 illustrates the behavior of the thermal resistance as a function of heat load. Also in these graphs, the results of un-finned thermosyphon with the same characteristics are presented [13], in order to analyze the effectiveness of the extended surfaces.…”

Experimental Analysis of a Screen-Covered Groove Heat Pipe

“…The methodology for manufacture (cleaning, assembly, tightness test, evacuation procedure, and filling with the working fluid); test; and analysis of the heat pipe were developed based on Nishida (2016), Russo et al (2016), Krambeck et al (2017), and Santos et al (2017).…”

“…Hence, according to Çengel and Ghajar (2015), the thermal management of electronic packaging has become a key technique in many applications. The heat pipes are passive devices based on phase change of the working fluid, which can be a good technological solution to the stabilization of microelectronic devices temperature (Krambeck et al, 2017). Major advantages of heat pipes include a very high thermal conductance, no moving parts, no pumping power requirements, and relatively low pressure drops (Faghri, 2014).…”