To improve the processability of micropolymer-based devices used for biomedical applications, poly(lactic acid) (PLA) was melt-blended with poly(ethylene glycol)s (PEGs) of different molecular weights (MWs; weight-average MWs 5 200, 800, 2000, and 4000; these PEGS are referred to as PEG200, PEG800, PEG2000, and PEG4000, respectively, in this article). The thermal properties, mechanical properties, and rheological properties of the PLA and the PLA-PEG blends were investigated. The tensile samples' morphologies showed that the low-MW PEGs filled molds well. The rheological properties confirmed that the low-MW PEGs decreased the complex viscosity, and improved the processability. With decreasing PEG MW, the PLA glass-transition temperature decreased. The nanoindenter data show that the addition of PEG decreased the modulus and hardness of PLA. The morphologies of the tensile samples showed that with increasing PEG MW, the thicknesses of the core layers increased gradually. The elongation at break was improved by approximately 247% with the addition of PEG200. Such methods can produce easily processed biological materials for producing biomedical products.
This paper discusses the Structure and preparation of laser direct writing process circuit board materials and key devices, introduces the laser chemical vapor deposition of circuit board material, laser-induced liquid reactive deposition circuit board materials and laser cladding wiring, in order to avoid laser excessive damage to the substrate surface. The overall surface of the substrate coated with a Film of heat actuable adhesive, then evenly spread a layer of metal powder, after roll, using laser heating to activate adhesive film, on the ceramic substrate and glass substrate, cladding and preparation to become line material and various passive components materials, that is to say, direct write a line and thick film resistive device on the circuit board, study the parameters and optimization of laser micro-cladding IC material manufacturing equipment, with silver and Ag-Pd alloy powder as a conductive metal and organic film material as an organic slurry system of binder phase, can prepare metal wire material in an organic epoxy board, having a thickness of 20 m , the minimum width may be less than 80 m , the conductivity 10 -5 .
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