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An electrolytic copper rod was drawn in 24 passes to a 90 pct reduction in area and subsequently annealed under various conditions. The global texture of the drawn wire, as measured by X-ray methods, showed a fiber texture approximated by a strong ͗111͘ and a weak ͗100͘ component. However, its microtexture, as measured by electron backscattered diffraction (EBSD), indicated that the major ͗111͘ ϩ minor ͗100͘ duplex fiber texture was dominant only in the center region, while a relatively diffuse texture developed with a somewhat higher density of orientations having a ͗11w͘// wire axis in the middle and surface regions. The inhomogeneous texture in the as-deformed wire gave rise to an inhomogeneous microstructure and texture after annealing. When annealed at 300 ЊC or 600 ЊC for 3 hours, the wire developed a duplex fiber texture consisting of major ͗100͘ ϩ minor ͗111͘ components in the center region, a strong ͗100͘ fiber texture in the middle region, and a weak texture consisting of ͗111͘ and ͗100͘ components with the ͗111͘ component being slightly stronger in the surface region. When the drawn wire was annealed at the high temperature of 700 ЊC, the texture at short annealing times was similar to that of the wire annealed at the lower temperatures of 300 ЊC and 600 ЊC for 3 hours, but prolonged annealing gave rise to a texture ranging from the ͗111͘ to ͗112͘ components due to abnormal grain-growth that started in the surface region. The recrystallization texture consisting of the major ͗100͘ ϩ minor ͗111͘ components was explained by the strain-energy-release maximization (SERM) model, in which the recrystallization texture is determined such that the absolute maximum principal stress direction due to dislocations in the deformed state is along the minimum elastic-modulus direction in recrystallized grains. On the other hand, the abnormal grain-growth texture was attributed to grain-boundary mobility differences between differently oriented grain.

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A study has been made of the deformation and recrystallization textures of 99.99% pure copper sheets which were cross rolled by 82 and 96% reduction in thickness and recrystallized in a salt bath at 450°C for 1h. The deformation texture was approximated by the {011}〈755〉 orientation as the major component and {001}〈100〉 as a minor component. These deformation texture components were well simulated using the rate sensitive relaxed constraints model. The {001}〈100〉 orientation was calculated to be metastable while the {011}〈755〉 orientation was located in the middle of the rotation path between the stable orientations in two cross rolling directions. The recrystallization texture in the center layer of the 96% cross-rolled copper sheet was approximated by {86 50 9}〈10 34 94〉 for each rolling direction. The evolution of the recrystallization texture was discussed based on the strain energy release maximization model.