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Cooling of miniature size electronic components has become challenging for designer in the development of integrated circuits. Micro pin fin heat sink and Micro channel pin fin heat sink is one of the thermal management technique for effective cooling. The paper presents comparison of fluid flow and heat transfer characteristics for micro pin fin heat sink and micro channel pin fin heat sink with UN finned micro channel heat sink. A Three Dimensional heat sink with water as coolant subjected to constant heat flux 10W/cm 2 , for Reynolds number ranging between100-900 is considered for study. Extended surfaces of different shapes namely square and circular with staggered arrangement is considered for both micro pin fin heat sink and micro channel pin fin heat sink. Two non-dimensional parameter namely nusselt number and thermal performance index is employed to access the performance of heat sink. Results indicate Micro channel pin fin heat sink has highest nusselt number and friction factor over the whole Reynolds number range. Results also revealed that formation of secondary vortices enhances heat transfer in micro channel heat sink with square pin fin compared to micro channel heat sink with circular pin fin. However pin fin heat sink has better thermal performance index compared to Micro channel pin fin heat sink and is more preferable when heat dissipation is compared with pressure drop penalty. The Governing equations for fluid and solid domain are solved using FLUENT 6.2 to study flow and heat transfer characteristics.

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