SummaryIn this article we present the development of a multibeam two-photon laser scanning microscope. A new type of beam splitter to create the multitude of laser beams is described. This type of beam splitter has higher transmission and generates more uniform beams than can be achieved with the microlens approach used by other groups. No crosstalk exists between the different foci due to small temporal delays between the individual beams. The importance of dispersion compensation to obtain maximum efficiency of the microscope is discussed. With optimum compensation the fluorescence signal was raised by a factor of 14. Different modes of detecting the fluorescence signals and their effect on imaging speed and resolution are discussed.
The application of customized and freeform illumination source shapes is a key enabler for continued shrink using 193 nm water based immersion lithography at the maximum possible NA of 1.35. In this paper we present the capabilities of the DOE based Aerial XP illuminator and the new programmable FlexRay illuminator. Both of these advanced illumination systems support the generation of such arbitrarily shaped illumination sources. We explain how the different parts of the optical column interact in forming the source shape with which the reticle is illuminated. Practical constraints of the systems do not limit the capabilities to utilize the benefit of freeform source shapes vs. classic pupil shapes. Despite a different pupil forming mechanism in the two illuminator types, the resulting pupils are compatible regarding lithographic imaging performance so that processes can be transferred between the two illuminator types. Measured freeform sources can be characterized by applying a parametric fit model, to extract information for optimum pupil setup, and by importing the measured source bitmap into an imaging simulator to directly evaluate its impact on CD and overlay. We compare measured freeform sources from both illuminator types and demonstrate the good matching between measured FlexRay and DOE based freeform source shapes.
The EUV mask infrastructure is of key importance for the successful introduction of EUV lithography into volume production. In particular, for the production of defect free masks an actinic review of potential defect sites is required. ZEISS and the SUNY POLY SEMATECH EUVL Mask Infrastructure consortium started a development program for such an EUV aerial image metrology system, the AIMS™ EUV. In this paper, we provide measurement data on the system's key specifications and discuss its performance and capability status.
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