Polyethylene glycol (PEG) is an additive that is commonly used as a suppressor in the semiconductor copper (Cu)-electroplating process. In this study, electrochemical impedance spectroscopy (EIS) was used to analyze the electrochemical behavior of PEG in the Cu-electroplating process. Polarization analysis, cyclic-voltammetry stripping, and cell voltage versus plating time were examined to clarify the suppression behavior of PEG. The equivalent circuit simulated from the EIS data shows that PEG inhibited the Cu-electroplating rate by increasing the charge-transfer resistance as well as the resistance of the adsorption layer. The presence of a large inductance demonstrated the strong adsorption of cuprous-PEG-chloride complexes on the Cu surface during the Cu-electroplating process. Increasing the PEG concentration appears to increase the resistances of charge transfer, the adsorption layer, and the inductance of the electroplating system.
Langmuir-Blodgett films of polyvinylidene fluoride trifluoroethylene - P(VDF-TrFE)-copolymers possess substantially improved electrocaloric and pyroelectric properties, when compared with conventionally spin-cast films. In order to rationalize this, we prepared single-layered films of P(VDF-TrFE) (70 : 30) using both deposition techniques. Grazing incidence wide-angle X-ray scattering (GIWAXS), reveals that Langmuir-Blodgett deposited films have a higher concentration of the ferroelectric β-phase crystals, and that these films are highly oriented with respect to the substrate. Based on these observations, we suggest alternative means of deposition, which may substantially enhance the electrocaloric effect in P(VDF-TrFE) films. This development has significant implications for the potential use of P(VDF-TrFE) in solid-state refrigeration.
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