Transition from multi-layer to monolayer and sub-monolayer thickness leads to the many exotic properties and distinctive applications of two-dimensional (2D) MoS2. This transition requires atomic-layer-precision thinning of bulk MoS2 without damaging the remaining layers, which presently remains elusive. Here we report a soft, selective and high-throughput atomic-layer-precision etching of MoS2 in SF6 + N2 plasmas with low-energy (<0.4 eV) electrons and minimized ion-bombardment-related damage. Equal numbers of MoS2 layers are removed uniformly across domains with vastly different initial thickness, without affecting the underlying SiO2 substrate and the remaining MoS2 layers. The etching rates can be tuned to achieve complete MoS2 removal and any desired number of MoS2 layers including monolayer. Layer-dependent vibrational and photoluminescence spectra of the etched MoS2 are also demonstrated. This soft plasma etching technique is versatile, scalable, compatible with the semiconductor manufacturing processes, and may be applicable for a broader range of 2D materials and intended device applications.

In this letter, we investigated the behaviors of surface-and buffer-induced current collapse in AlGaN/GaN high-electron mobility transistors (HEMTs) using a soft-switched pulsed I-V measurement with different quiescent bias points. It is found that the surface-and buffer-related current collapse have different relationship with the gate and drain biases (V GS0, V DS0 ) during quiescent bias stress. The surface-induced current collapse in devices without passivation monotonically increases with the negative V GS0 , suggesting that an electron injection to the surface from gate leakage is the dominant mechanism and the Si 3 N 4 passivation could effectively eliminate such current collapse. The buffer-induced current collapse in devices with intentionally carbon-doped buffer layer exhibits a different relationship with V GS0 after surface passivation. The buffer-related current collapse shows a bell-shaped behavior with V GS0 , suggesting that a hot electron trapping in the buffer is the dominant mechanism. The soft-switched pulsed I-V measurement provides an effective method to distinguish between the surface-and buffer-related current collapse in group III-nitride HEMTs.

The forward current transport mechanisms in Ni/Au-AlGaN/GaN Schottky diodes are studied by temperature dependent current-voltage (T-I-V) measurements from 298 to 473 K. The zero-bias barrier height qϕBn and ideality factor values determined based on the conventional thermionic-emission (TE) model are strong functions of temperature, which cannot be explained by the standard TE theory. Various transport models are considered to analyze the experimental I-V data. The fitting results indicate that the increased current at low bias is due to the trap-assisted tunneling with an effective trap density of about 8.8 × 106 cm−2, while the high-bias current flow is dominated by the TE transport mechanism, accompanied by a significant series resistance effect. By fitting the high-forward-bias I-V characteristics, the effective qϕBn values with a small negative temperature coefficient are obtained. The temperature dependence of the saturation tunneling current and qϕBn is finally explained by considering the thermally induced band gap shrinkage effect.

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