There is a significant need for site-specific and on-demand cooling in electronic, optoelectronic and bioanalytical devices, where cooling is currently achieved by the use of bulky and/or over-designed system-level solutions. Thermoelectric devices can address these limitations while also enabling energy-efficient solutions, and significant progress has been made in the development of nanostructured thermoelectric materials with enhanced figures-of-merit. However, fully functional practical thermoelectric coolers have not been made from these nanomaterials due to the enormous difficulties in integrating nanoscale materials into microscale devices and packaged macroscale systems. Here, we show the integration of thermoelectric coolers fabricated from nanostructured Bi2Te3-based thin-film superlattices into state-of-the-art electronic packages. We report cooling of as much as 15 degrees C at the targeted region on a silicon chip with a high ( approximately 1,300 W cm-2) heat flux. This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.
In order to help provide access to advanced MEMS technologies, and lower the barriers for both industry and academia, MCNC and ARPA have developed a program which works to provide users with access to both MEMS processes and advanced integration techniques. The two distinct aspects of this program, the MUMPs and Smart MEMS, will be described in this paper. The Multi-User MEMS Processes (MUMPs) is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. MUMPs is a proof-of-concept and educational tool to aid the development of MEMS in the domestic community. MUMPs technologies currently include a 3-layer polysilicon surface micromachining process and LIGA processes that provide reasonable design flexibility within set guidelines. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology.
Knowledge and control of residual strain is critical for device design in MEMS, and therefore it is important to establish standards for residual strain measurement. In this study, pointer, microring, bent-beam, and fixed-fixed beam test structures are used to evaluate residual strain both theoretically and experimentally. An equation that enables easier evaluation of bentbeam structures is derived. Also, a finite difference model that incorporates the non-idealities of fixed-fixed beams and determines an optimum fit to the measured deflection curve is presented. The model allows accurate residual strain evaluation of each buckled fixed-fixed beam. Experimentally, pointer structures were found to be susceptible to adhesion. Microrings, intended for residual tension assessment, also could not be evaluated because the residual strain was compressive. Bent-beam and fixed-fixed beams could both be evaluated. The main criterion for test structure effectiveness was taken to be the repeatability of residual strain on structures in close proximity; each should exhibit the same value. Using optical microscopy, the residual strain of bent-beams was determined with ± 13 µε repeatability based on standard deviation of adjacent structures of similar design. Using optical interferometry, the residual strain of fixed-fixed beams was determined with ± 2 µε repeatability based on standard deviation for adjacent beams of different lengths. The strain values obtained from the two structures are in reasonably good agreement. Cantilevers were also evaluated to obtain film curvature values.
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