The current development of applications for sensor-based robotic and automation (R&A) systems is typically a "one-of-a-kind" pmcess, where most software is developed from scratch, even though much of the code is similar to code written for other applications. The cost of these systems can be drastically reduced and the capability of these systems improved by providing a suitable software framework for all R&A system. We describe a novel software framework, based on the notion of dynamically reconfigurable software for sensor-based control systems. Tools to suppon the implementation of this framework have been built into the Chimera 3.0 Real-Time Operating System. The framework provides for the systematic development and predictable execution of flexible R&A applications while maintaining the ability to reuse code from previous applications. It combines object-oriented design of software with port-automaton design of digital control systems. A control module is an instance of a class of port-based objects. A task set is formed by integrating objects from a module library to form a specific configuration. An implementation using global state variables for the automatic integration of port-based objects is presented. A control subsystem is a collection of jobs which are executed one at a time, and can be programmed by a user. Multiple control subsystems can execute in parallel, and operate either independently or cooperatively. One of the fundamental concepts of reconfigurable software design is that modules are developed independent of the target hardware. Our framework defines classes of reconfigurable device driver objects for proving hardware independence to YO devices, sensors, actuators, and special purpose processors. Hardware independent real-time communication mechanisms for inter-subsystem communication are also described. Along with providing a foundation for design of dynamically reconfigurable real-time software, we are. also developing many modules for the control module, device driver, and subroutine libraries. As the libraries continue to grow, they will form the basis of code that can eventually be used by future R&A applications. There will no longer be a need for developing software from scratch for new applications. since many required modules will already be available in one of the libraries.
Three-dimensional thin-film solid-state batteries (3D TSSB) were proposed by Long et al. in 2004 as a structure-based approach to simultaneously increase energy and power densities. Here, we report experimental realization of fully conformal 3D TSSBs, demonstrating the simultaneous power-and-energy benefits of 3D structuring. All active battery components-electrodes, solid electrolyte, and current collectors-were deposited by atomic layer deposition (ALD) onto standard CMOS processable silicon wafers microfabricated to form arrays of deep pores with aspect ratios up to approximately 10. The cells utilize an electrochemically prelithiated LiVO cathode, a very thin (40-100 nm) LiPON solid electrolyte, and a SnN anode. The fabrication process occurs entirely at or below 250 °C, promising compatibility with a variety of substrates as well as integrated circuits. The multilayer battery structure enabled all-ALD solid-state cells to deliver 37 μAh/cm·μm (normalized to cathode thickness) with only 0.02% per-cycle capacity loss. Conformal fabrication of full cells over 3D substrates increased the areal discharge capacity by an order of magnitude while simulteneously improving power performance, a trend consistent with a finite element model. This work shows that the exceptional conformality of ALD, combined with conventional semiconductor fabrication methods, provides an avenue for the successful realization of long-sought 3D TSSBs which provide power performance scaling in regimes inaccessible to planar form factor cells.
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