Aerosol deposition method was used as an alternative deposition technique in crystalline electrolyte deposition process. Crystalline Li1.3Al0.3Ti1.7(PO4)3 thick layers were successfully deposited on stainless‐steel substrates and X‐ray diffractometry, scanning electron microscopy, transmission electron microscopy, and AC impedance techniques were used to characterize these films. The density of the deposited films was between 83% and 86% of the theoretical density and Vickers hardness was calculated to have values between 260 and 280 Hv. Bulk and total conductivities were 3.62 × 10−3 and 1.12 × 10−6 S/cm, respectively, and DC conductivity was <10−10 S/cm for a wide range of film thicknesses. Improvement in total conductivity of the Li1.3Al0.3Ti1.7(PO4)3 samples is still needed to make these films more suitable for all‐solid‐state Li‐ion batteries.
Ba 0:6 ,Sr 0:4 )TiO 3 thick films were fabricated on Pt/Ti/SiO 2 /Si, stainless steel (SUS) and Cu substrates by aerosol deposition (AD) technique. The effect of substrate on physical and electrical properties of the fabricated films has been studied. The ADformed films have an average grain size of 15.9 to 18.3 nm, substrate having a small effect on its value. Strain is affected by the substrate selection and it is smallest when Cu has been selected as the metal substrate for AD of (Ba 0:6 ,Sr 0:4 )TiO 3 powder, having a value of 0.00552. The leakage current of (Ba 0:6 ,Sr 0:4 )TiO 3 thick films deposited on Cu substrates is smaller that for films deposited on Pt/Ti/SiO 2 /Si and SUS substrates being less than 10 À7 A/cm 2 at 200 kV/cm applied electric field. The above results indicate that Cu is a good candidate for metallization in multilayered capacitor structure fabrication when AD technique is used for dielectric film formation.
The effect of thermal treatment on physical properties of (Ba0.6,Sr0.4)TiO3 (BST60) ferroelectric thick films deposited by aerosol deposition (AD) technique has been investigated by x-ray photoelectron spectroscopy (XPS) and complex impedance spectroscopy (CIS) to explain the leakage current behavior of the films. The leakage current increases when the thermal treatment temperature was increased. By XPS analysis it was found that the films are not formed entirely of BST60 phase. Carbonates of Ba or/and Sr and TiO2 coexist with the BST phase, and it is believed to play an important role in the properties of the AD-deposited BST60 thick films. CIS analysis revealed that the grain boundary region becomes less resistive with the increase in thermal treatment temperature. Also, it has been observed after comparing the electric modulus of green and thermally treated samples that the activation energy for electron-hole formation becomes smaller with the increase in thermal treatment temperature above 600 °C. Decrease in resistivity at the grain boundary regions and activation energy is believed to be caused by the diffusion from the highly conductive isolated areas present in the grain boundary toward the entire grain boundary area with increase in thermal treatment temperature.
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