Memristors have many uses in machine learning and neuromorphic hardware. From memory elements in dot product engines to replicating both synapse and neuron wall behaviors, the memristor has proved a versatile component. Here we demonstrate an analog mode of operation observed in our silicon oxide memristors and apply this to the problem of edge detection. We demonstrate how a potential divider exploiting this analog behavior can prove a scalable solution to edge detection. We confirm its behavior experimentally and simulate its performance on a standard testbench. We show good performance comparable to existing memristor based work with a benchmark score of 0.465 on the BSDS500 dataset, while simultaneously maintaining a lower component count.

Resistive random-access memories, also known as memristors, whose resistance can be modulated by the electrically driven formation and disruption of conductive filaments within an insulator, are promising candidates for neuromorphic applications due to their scalability, low-power operation and diverse functional behaviors. However, understanding the dynamics of individual filaments, and the surrounding material, is challenging, owing to the typically very large cross-sectional areas of test devices relative to the nanometer scale of individual filaments. In the present work, conductive atomic force microscopy is used to study the evolution of conductivity at the nanoscale in a fully CMOS-compatible silicon suboxide thin film. Distinct filamentary plasticity and background conductivity enhancement are reported, suggesting that device behavior might be best described by composite core (filament) and shell (background conductivity) dynamics. Furthermore, constant current measurements demonstrate an interplay between filament formation and rupture, resulting in current-controlled voltage spiking in nanoscale regions, with an estimated optimal energy consumption of 25 attojoules per spike. This is very promising for extremely low-power neuromorphic computation and suggests that the dynamic behavior observed in larger devices should persist and improve as dimensions are scaled down.

The limited sensitivity of existing analysis techniques at the nanometer scale makes it challenging to systematically examine the complex interactions in redox-based resistive random access memory (ReRAM) devices. To test models of oxygen movement in ReRAM devices beyond what has previously been possible, we present a new nanoscale analysis method. Harnessing the power of secondary ion mass spectrometry, the most sensitive surface analysis technique, for the first time, we observe the movement of 16O across electrically biased SiOx ReRAM stacks. We can therefore measure bulk concentration changes in a continuous profile with unprecedented sensitivity. This reveals the nanoscale details of the reversible field-driven exchange of oxygen across the ReRAM stack. Both the reservoir-like behavior of a Mo electrode and the injection of oxygen into the surface of SiOx from the ambient are observed within one profile. The injection of oxygen is controllable through changing the porosity of the SiOx layer. Modeling of the electric fields in the ReRAM stacks is carried out which, for the first time, uses real measurements of both the interface roughness and electrode porosity. This supports our findings helping to explain how and where oxygen from ambient moisture enters devices during operation.

The caption states the potentiation and depression observed in Fig. 21a and 21b respectively are for separate devices with different composition. Is it that each device exhibits only one of the behaviours shown or do the two devices exhibit both potentiation and depression as well? Also, what is the retention time of this potentiation and depression? Hyunsang Hwang responded: Thank you for your comment. It was a typo. We measured potentiation and depression using a Mo/TiO x /TiN device. I will revise the manuscript. Although we did not perform an in-depth study on retention characteristics, we cannot guarantee long-term retention using the Mo/TiO x /TiN device. Hyunsang Hwang answered: Thank you for your comments. I agree with your comments. We consider I-V linearity to implement matrix multiplication using an analog input voltage. If we cannot meet ideal I-V linearity, we can integrate the read current with multiple pulses which require additional circuits.

We report that implanting argon ions into a film of uniform atomic layer deposition (ALD)-grown SiOx enables electroforming and switching within films that previously failed to electroform at voltages <15 V. We note an implantation dose dependence of electroforming success rate: electroforming can be eliminated when the dosage is high enough. Our devices are capable of multi-level switching during both set and reset operations, and multiple resistance states can be retained for more than 30,000 s under ambient conditions. High endurance of more than 7 million (7.9 × 106) cycles is achieved alongside low switching voltages (±1 V). Comparing SiOx fabricated by this approach with sputtered SiOx we find similar conduction mechanisms between the two materials. Our results show that intrinsic SiOx switching can be achieved with defects created solely by argon bombardment; in contrast to defects generated during deposition, implantation generated defects are potentially more controllable. In the future, noble ion implantation into silicon oxide may allow optimization of already excellent resistance switching devices.