Abstruct-A solution to the problem of plane wave scattering by a rectangular microstrip patchon a grounded dielectric substrate is presented. The model does not include the microstrip feed, and thus does not include the so-called "antenna mode" component of the scattering. The solution begins by formulating an electric field integral equation for the surface current density on the microstrip patch. The integral equation is solved using the method of moments. Computed data for the patch radar cross section (RCS) is found to be in close agreement with measurements over a broad frequency range. The microstrip RCS versus frequency consists of a number of large peaks which are identified as impedance or pattern factor resonance peaks.
We report on fabrication and characterization of arrays of bimaterial microcantilevers and discuss their performance as uncooled infrared imagers. An optical readout was used to simultaneously measure deflections of all microcantilevers in the array. The fabricated arrays had an average noise equivalent temperature difference (NETD) and a response time of 1.5K and 6ms, respectively. Some microcantilevers in the array exhibited NETD values below 500mK, approaching our theoretical prediction of 151mK. A unique and valuable feature of the implemented approach is its straightforward scalability to higher resolution arrays, without progressively growing complexity and cost.
We report on the fabrication and characterization of microcantilever based uncooled focal plane array (FPA) for infrared imaging. By combining a streamlined design of microcantilever thermal transducers with a highly efficient optical readout, we minimized the fabrication complexity while achieving a competitive level of imaging performance. The microcantilever FPAs were fabricated using a straightforward fabrication process that involved only three photolithographic steps (i.e. three masks). A designed and constructed prototype of an IR imager employed a simple optical readout based on a noncoherent low-power light source. The main figures of merit of the IR imager were found to be comparable to those of uncooled MEMS infrared detectors with substantially higher degree of fabrication complexity. In particular, the NETD and the response time of the implemented MEMS IR detector were measured to be as low as 0.5K and 6 ms, respectively. The potential of the implemented designs can also be concluded from the fact that the constructed prototype enabled IR imaging of close to room temperature objects without the use of any advanced data processing. The most unique and practically valuable feature of the implemented FPAs, however, is their scalability to high resolution formats, such as 2000x2000, without progressively growing device complexity and cost.
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