A sonochemical-microwave hydrothermal method for preparing fluorinated mesoporous TiO 2 microspheres was developed. Fabrication of mesoporous TiO 2 and doping of fluorine were achieved by sonication and then hydrothermal treatment of a solution containing TiO 2 precursor sol and sodium fluoride. The average diameter of as synthesised TiO 2 microspheres was y500 nm. Since the sodium fluoride was doped, rod-like grains (12¡0?5 nm) and microporous structure (y10 nm) formed on the surface, he roughness was clearly increased, and the microspheres look like waxberries. UV-vis absorption spectra showed that samples within the wavelength range from 0 to 300 nm show strong UV absorption and 10 nm BM-shift, which was highly related to its microstructures. The TEM and high resolution TEM results showed a novel mechanism for fluorinated TiO 2 microsphere formation, i.e. its rod-assembled mesoporous microstructures related to the absorption of water molecules on the surface of the microspheres.
The CHIPIC code, a fully electromagnetic particle-in-cell (PIC) code for modeling and simulations of high-power microwave (HPM) devices, is introduced in this paper. It consists of a two-dimensional (2D) code and a three-dimensional (3D) code. The 2D code can model and simulate HPM devices with symmetric structure on 2D Cartesian, cylindrical and polar grids, while the 3D code can model and simulate HPM devices on 3D Cartesian and cylindrical grids. The fields are calculated using the finite-difference time-domain scheme, and the particles are described by the PIC scheme. Various types of boundary conditions have also been implemented for different kinds of applications. In addition, the 3D code is specifically designed for high-performance modeling and computing. It uses the message passing interface and the open specifications for multiprocessing (OpenMP) for parallelization. Its parallel design ensures that it is capable of efficiently executing on a variety of architectures. In order to allow efficient use of parallel architectures, it provides automated partitioning and dynamic load balancing. Even though this code is still in development, it has successfully simulated various real-world HPM experimental devices. Simulation results on some typical HPM devices by using the CHIPIC code are given, which agree well with those obtained from some well-known PIC codes. Direction for future work is also presented.
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