Abstract-Advances in the chip fabrication technology have begun to make manufacturing 3D chips a reality. The road ahead presents many challenges both in the technology and the EDA domains before potential benefits of tightly integrated 3D systems can be reaped. We present our placement and routing algorithms for 3D FPGA and ASIC designs. Our method addresses wire length, delay and area minimization, as well as thermal optimization during placement and routing phases. These flows have been used to obtain optimized layouts for benchmarks with tens to hundreds of thousands of cells.
Carbon monoxide (CO) is a toxic gas, and environmental pollutant. Its detection and control in residential and industrial environments are necessary in order to avoid potentially severe health problems in humans. In this review paper, we discuss the importance of furthering research in CO sensing technologies for finding the proper material with low-range detection ability in very optimum condition. We build our discussion through the perspective of a cyber-physical system (CPS) modeling framework, because it provides a comprehensive framework to model and develop automated solutions for detection and control of poisonous chemical compounds, such as the CO. The most effective CO sensors, then, can be used in CPS network to provide a pathway for real-time monitoring and control in both industrial and household environment. In this paper, first, we discuss the necessity of CO detection, the proposal of a basic CPS framework for modeling and system development, how the CPS-CO model can be beneficiary to the environment, and a general classification of the various CO detection mechanisms. Next, a broad overview emphasizes the sensitivity, selectivity, response and recovery time, low concentration detection ability, effects of external parameters and other specifications that characterize the performance of the sensing methods proposed so far. We will discuss recent studies reported on the use of metal oxide semiconductor (MOS) sensing technologies for the detection of CO. MOS based micro-sensors play an important role in the measurement and monitoring of various trace amounts of CO gas. These sensors are used to sense CO through changes in their electrical properties. In addition to MOS based sensors, optical sensing methods have recently become popular, due to their increased performance. Hence, a brief overview of newly proposed optical based CO detection methods is provided as well.
The efficiency of network reconfiguration depends on both the efficiency of the loss estimation technique and the efficiency of the reconfiguration approach itself. We propose two novel algorithmic techniques for speeding-up the computational runtime of both problems. First, we propose an efficient heuristic algorithm to solve the distribution network reconfiguration problem for loss reduction. We formulate the problem of finding incremental branch exchanges as a minimum cost maximum flow problem. This approach finds the best set of concurrent branch exchanges yielding larger loss reduction with fewer iterations, hence significantly reducing the computational runtime. Second, we propose an efficient random walks-based technique for the loss estimation in radial distribution systems. The novelty of this approach lies in its property of localizing the computation. Therefore, bus voltage magnitude updates can be calculated in much shorter computational runtimes in scenarios where the distribution system undergoes isolated topological changes, such as in the case of network reconfiguration. Experiments on distribution systems with sizes of up to 10 476 buses demonstrate that the proposed techniques can achieve computational runtimes shorter with up to 7.78 times and with similar or better loss reduction compared to the Baran's reconfiguration technique [1].
-We present timing-driven partitioning and simulated annealing based placement algorithms together with a detailed routing tool for 3D FPGA integration. The circuit is first divided into layers with limited number of inter-layer vias, and then placed on individual layers, while minimizing the delay of critical paths. We use our tool as a platform to explore the potential benefits in terms of delay and wire-length that 3D technologies can offer for FPGA fabrics. Experimental results show on average a total decrease of 21% in wire-length and 24% in delay, can be achieved over traditional 2D chips, when five layers are used in 3D integration.
-In this paper we present multi-objective hMetis partitioning for simultaneous cutsize and circuit delay minimization. We change the partitioning process itself by introducing a new objective function that incorporates a truly path-based delay component for the most critical paths. To avoid semi-critical paths from becoming critical, the traditional slackbased delay component is also included in the cost function. The proposed timing driven partitioning algorithm is built on top of the hMetis algorithm, which is very efficient. Simulations results show that 14% average delay improvement can be obtained. Smooth trade-off between cutsize and delay is possible in our algorithm.
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