Quantitative phase analysis is first performed on doped Hafnia films to elucidate the structural origin of unexpected ferroelectricity.

Recently simulation groups have reported the lanthanide series elements as the dopants that have the strongest effect on the stabilization of the ferroelectric non-centrosymmetric orthorhombic phase in hafnium oxide. This finding confirms experimental results for lanthanum and gadolinium showing the highest remanent polarization values of all hafnia-based ferroelectric films until now. However, no comprehensive overview that links structural properties to the electrical performance of the films in detail is available for lanthanide-doped hafnia. La:HfO appears to be a material with a broad window of process parameters, and accordingly, by optimization of the La content in the layer, it is possible to improve the performance of the material significantly. Variations of the La concentration leads to changes in the crystallographic structure in the bulk of the films and at the interfaces to the electrode materials, which impacts the spontaneous polarization, internal bias fields, and with this the field cycling behavior of the capacitor structure. Characterization results are compared to other dopants like Si, Al, and Gd to validate the advantages of the material in applications such as semiconductor memory devices.

the formation of a non-centrosymmetric Pca2 1 orthorhombic phase (o-phase). [1][2][3][4][5][6][7] For increasing doping concentrations, ALD HfO 2 films undergo a phase transition from a non-ferroelectric m-phase to ferroelectric orthorhombic phase and for higher concentrations to the tetragonal phase (t-phase; space group: P4 2 /nmc) if the dopants are smaller than Hf like Si and Al, or to the cubic phase if the dopants are larger than Hf like Gd, La, Sr, and Y. [8] Besides the influence of doping, four other factors are known to promote the stabilization of the ferroelectric phase: surface or interface/grain boundary energy, film stress, and the presence of oxygen vacancies. [9][10][11][12][13] Oxygen vacancies and the related defect states play an important role in the so-called wake-up effect. [14] Wake-up describes the increase of the remanent polarization during electrical field cycling with opening of an initially pinched polarization-voltage hysteresis. [11] In Hf 1−x Zr x O 2 films, Materlik et al. suggested that the bulk and surface free energy of the o-phase is located between those of the m-phase and t-phase. As a result, the o-phase is stabilized in a specific film thickness and grain size region. This suggestion matches well Thin film metal-insulator-metal capacitors with undoped HfO 2 as the insulator are fabricated by sputtering from ceramic targets and subsequently annealed. The influence of film thickness and annealing temperature is characterized by electrical and structural methods. After annealing, the films show distinct ferroelectric properties. Grazing incidence X-ray diffraction measurements reveal a dominant ferroelectric orthorhombic phase for thicknesses in the 10-50 nm range and a negligible non-ferroelectric monoclinic phase fraction. Sputtering HfO 2 with additional oxygen during the deposition decreases the remanent polarization. Overall, the impact of oxygen vacancies and interstitials in the HfO 2 film during deposition and annealing is correlated to the phase formation process.

Ferroelectric HfO2-based thin films, which can exhibit ferroelectric properties down to sub-10 nm thicknesses, are a promising candidate for emerging high density memory technologies. As the ferroelectric thickness continues to shrink, the electrode-ferroelectric interface properties play an increasingly important role. We investigate the TaN interface properties on 10 nm thick Si-doped HfO2 thin films fabricated in a TaN metal-ferroelectric-metal stack which exhibit highly asymmetric ferroelectric characteristics. To understand the asymmetric behavior of the ferroelectric characteristics of the Si-doped HfO2 thin films, the chemical interface properties of sputtered TaN bottom and top electrodes are probed with x-ray photoelectron spectroscopy. Ta-O bonds at the bottom electrode interface and a significant presence of Hf-N bonds at both electrode interfaces are identified. It is shown that the chemical heterogeneity of the bottom and top electrode interfaces gives rise to an internal electric field, which causes the as-grown ferroelectric domains to preferentially polarize to screen positively charged oxygen vacancies aggregated at the oxidized bottom electrode interface. Electric field cycling is shown to reduce the internal electric field with a concomitant increase in remanent polarization and decrease in relative permittivity. Through an analysis of pulsed transient switching currents, back-switching is observed in Si-doped HfO2 thin films with pinched hysteresis loops and is shown to be influenced by the internal electric field.