A packaging technology for global (N4) free space optical interconnections has been developed and implemented by means of hybrid integration using solder engineering. Solder arrays, defined by photolithography and electrodeposition, are used to physically attach, optically align and electrically connect the microoptical components. A processing sequence has been fully developed for the fabrication of the emitter sub-assembly consisting of 8x8 and 16x16 arrays of vertical cavity surface emitting lasers and diffractive optical interconnect elements. The first level of integration consisting of the metal signal lines, ground plane and solder arrays has been completed with excellent uniformity and yield of the deposited solder.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.