<title>Processing of free-space optical interconnect devices using solder engineering</title>

Abstract

A packaging technology for global (N4) free space optical interconnections has been developed and implemented by means of hybrid integration using solder engineering. Solder arrays, defined by photolithography and electrodeposition, are used to physically attach, optically align and electrically connect the microoptical components. A processing sequence has been fully developed for the fabrication of the emitter sub-assembly consisting of 8x8 and 16x16 arrays of vertical cavity surface emitting lasers and diffractive optical interconnect elements. The first level of integration consisting of the metal signal lines, ground plane and solder arrays has been completed with excellent uniformity and yield of the deposited solder.