It is a challenge to synthesize materials that possess the properties of biological muscles-strong, elastic and capable of self-healing. Herein we report a network of poly(dimethylsiloxane) polymer chains crosslinked by coordination complexes that combines high stretchability, high dielectric strength, autonomous self-healing and mechanical actuation. The healing process can take place at a temperature as low as -20 °C and is not significantly affected by surface ageing and moisture. The crosslinking complexes used consist of 2,6-pyridinedicarboxamide ligands that coordinate to Fe(III) centres through three different interactions: a strong pyridyl-iron one, and two weaker carboxamido-iron ones through both the nitrogen and oxygen atoms of the carboxamide groups. As a result, the iron-ligand bonds can readily break and re-form while the iron centres still remain attached to the ligands through the stronger interaction with the pyridyl ring, which enables reversible unfolding and refolding of the chains. We hypothesize that this behaviour supports the high stretchability and self-healing capability of the material.

A polymer is described that is conductive and stretchable, which can lead to electronics that can conform to the human body.

Soft and conformable wearable electronics require stretchable semiconductors, but existing ones typically sacrifice charge transport mobility to achieve stretchability. We explore a concept based on the nanoconfinement of polymers to substantially improve the stretchability of polymer semiconductors, without affecting charge transport mobility. The increased polymer chain dynamics under nanoconfinement significantly reduces the modulus of the conjugated polymer and largely delays the onset of crack formation under strain. As a result, our fabricated semiconducting film can be stretched up to 100% strain without affecting mobility, retaining values comparable to that of amorphous silicon. The fully stretchable transistors exhibit high biaxial stretchability with minimal change in on current even when poked with a sharp object. We demonstrate a skinlike finger-wearable driver for a light-emitting diode.

SUMMARYThis paper presents new finite elements that incorporate strong discontinuities with linear interpolations of the displacement jumps for the modeling of failure in solids. The cases of interest are characterized by a localized cohesive law along a propagating discontinuity (e.g. a crack), with this propagation occurring in a general finite element mesh without remeshing. Plane problems are considered in the infinitesimal deformation range. The new elements are constructed by enhancing the strains of existing finite elements (including general displacement based, mixed, assumed and enhanced strain elements) with a series of strain modes that depend on the proper enhanced parameters local to the element. These strain modes are designed by identifying the strain fields to be captured exactly, including the rigid body motions of the two parts of a splitting element for a fully softened discontinuity, and the relative stretching of these parts for a linear tangential sliding of the discontinuity. This procedure accounts for the discrete kinematics of the underlying finite element and assures the lack of stress locking in general quadrilateral elements for linearly separating discontinuities, that is, spurious transfers of stresses through the discontinuity are avoided. The equations for the enhanced parameters are constructed by imposing the local equilibrium between the stresses in the bulk of the element and the tractions driving the aforementioned cohesive law, with the proper equilibrium operators to account for the linear kinematics of the discontinuity. Given the locality of all these considerations, the enhanced parameters can be eliminated by their static condensation at the element level, resulting in an efficient implementation of the resulting methods and involving minor modifications of an existing finite element code. A series of numerical tests and more general representative numerical simulations are presented to illustrate the performance of the new elements.

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A basic need in stretchable electronics for wearable and biomedical technologies is conductors that maintain adequate conductivity under large deformation. This challenge can be met by a network of one-dimensional (1D) conductors, such as carbon nanotubes (CNTs) or silver nanowires, as a thin film on top of a stretchable substrate. The electrical resistance of CNT thin films exhibits a hysteretic dependence on strain under cyclic loading, although the microstructural origin of this strain dependence remains unclear. Through numerical simulations, analytic models, and experiments, we show that the hysteretic resistance evolution is governed by a microstructural parameter [Formula: see text] (the ratio of the mean projected CNT length over the film length) by showing that [Formula: see text] is hysteretic with strain and that the resistance is proportional to [Formula: see text] The findings are generally applicable to any stretchable thin film conductors consisting of 1D conductors with much lower resistance than the contact resistance in the high-density regime.

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This paper presents the extension of some finite elements with embedded strong discontinuities to the fully transient range with the focus on dynamic fracture. Cracks and shear bands are modeled in this setting as discontinuities of the displacement field, the so-called strong discontinuities, propagating through the continuum. These discontinuities are embedded into the finite elements through the proper enhancement of the discrete strain field of the element. General elements, like displacement or assumed strain based elements, can be considered in this framework, capturing sharply the kinematics of the discontinuity for all these cases. The local character of the enhancement (local in the sense of defined at the element level, independently for each element) allows the static condensation of the different local parameters considered in the definition of the displacement jumps. All these features lead to an efficient formulation for the modeling of fracture in solids, very easily incorporated in an existing general finite element code due to its modularity. We investigate in this paper the use of this finite element formulation for the special challenges that the dynamic range leads to. Specifically, we consider the modeling of failure mode transitions in ductile materials and crack branching in brittle solids. To illustrate the performance of the proposed formulation, we present a series of numerical simulations of these cases with detailed comparisons with experimental and other numerical results reported in the literature. We conclude that these finite element methods handle well these dynamic problems, still maintaining the aforementioned features of computational efficiency and modularity.