Recent studies have increased the cut off frequencies achievable by exfoliated MoS 2 by employing a combination of channel length scaling and geometry modification. However, for industrial scale applications, the mechanical cleavage process is not scalable but, thus far, the same device improvements have not been realized on chemical vapor deposited MoS 2 . Here we use a gate-first process flow with an embedded gate geometry to fabricate short channel chemical vapor deposited MoS 2 radio frequency transistors with a notable f T of 20 GHz and f max of 11.4 GHz, and the largest high-field saturation velocity, v sat = 1.88 × 10 6 cm/s, in MoS 2 reported so far. The gate-first approach, facilitated by cm-scale chemical vapor deposited MoS 2 , offers enhancement mode operation, I ON /I OFF ratio of 10 8 , and a transconductance (g m ) of 70 μS/μm. The intrinsic f T (f max ) obtained here is 3X (2X) greater than previously reported top-gated chemical vapor deposited MoS 2 radio frequency field-effect transistors. With as-measured S-parameters, we demonstrate the design of a GHz MoS 2 -based radio frequency amplifier. This amplifier has gain greater then 15 dB at 1.2 GHz, input return loss > 10 dB, bandwidth > 200 MHz, and DC power consumption of~10 mW.

To achieve large area growth of transition metal dichalcogenides of uniform monolayer thickness, we demonstrate metal–organic chemical vapor deposition (MOCVD) growth under low pressure followed by a high-temperature sulfurization process under atmospheric pressure (AP). Following sulfurization, the MOCVD-grown continuous MoS 2 film transforms into compact triangular crystals of uniform monolayer thickness as confirmed from the sharp distinct photoluminescence peak at 1.8 eV. Raman and X-ray photoelectron spectroscopies confirm that the structural disorders and chalcogen vacancies inherent to the as-grown MOCVD film are substantially healed and carbon/oxygen contaminations are heavily suppressed. The as-grown MOCVD film has a Mo/S ratio of 1:1.6 and an average defect length of ∼1.56 nm, which improve to 1:1.97 and ∼21 nm, respectively, upon sulfurization. The effect of temperature and duration of the sulfurization process on the morphology and stoichiometry of the grown film is investigated in detail. Compared to the APCVD growth, this two-step growth process shows more homogenous distribution of the triangular monolayer MoS 2 domains across the entire substrate, while demonstrating comparable electrical performance.

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