This paper introduces black photoresist specially designed for making black layers on flexible film. Flexibility, broad tapered profile, high optical density (OD) and high electric resistance are achieved. The flexibility is suitable for film type devices and the high electric resistivity is likely suitable for black matrix (BM) and micro light emitted diode (LED).
Applying common photolithography process to flexible substrate with novel formulated lithographic chemicals, flexible touch sensor film can be manufactured by roll‐to‐roll process. Extremely fine copper pattern (<2um) could be obtained without using fine mask pattern and with no copper damaging. With proprietary low temperature curing flexible black matrix photoresist to make the fringe, all layers of metal mesh touch sensor can be integrated onto one film substrate to achieve true flexible touch for flexible displays. This integrated solution is enabled by four new formulated materials: one low temperature curing black matrix photoresist for fringe, one flexible positive‐tone photoresist and one copper etchant for fine circuit patterning, and one low temperature curing clear photoresist for passivation.
Fine copper circuit on flexible substrate is highly demanded components for flexible displays. Two methods have been developed for making high resolution (7um, L/S) circuits with copper thickness up to 10 um: positive‐tone photolithography/wet etching, and semi‐additive photolithography/plating/flash etching processes. High throughput roll‐to‐roll process can be applied using both methods with proprietary positive‐tone photoresists for manufacturing flexible backplane and connector circuits.
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