In this paper, a new method combining imprint lithography and multiimprint was discussed to improve the generic TFT process and develop an alignment machine for multilayer imprint and in order to decrease the times of the experiment, a new simulator is offered, too. A simple theorem is employed to complete a low cost alignment machine with alignment accuracy to 1 µm. Besides, in order to develop new TFT imprint photoresist, three kind of materials, AZ-series photoresist (a positive photoresist), HOSP (Hygrido Organic Siloxane Polymer) and SE-812, are tested for imprint and evaluate the applications of these materials in the future. The finite element analysis software that is DEFORM-3D is first used for simulating in MEMS.
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