Local electrochemical deposition (LECD) has proved to be an efficient and economical method for fabricating three-dimensional (3D) micron structures. Realizing complex structures that join up when deposited using LECD has been complex; therefore, the fabrication of an X-shaped joining structure was investigated in this study. A horizontal trace model was proposed, and the effects of the number of deposition layers and the horizontal sweep width on the merging joint were studied. The horizontal trace model could complete the merging joint. Multiple deposition layers and a large horizontal sweep width could stabilize and better connect the X-shaped structure containing merging joints. The merging mechanism of the X-shaped structure was also investigated using COMSOL. The stable deposition of the joining structure enables the LECD method to have a broader range of applications in micro-nano manufacturing.
Localized electrochemical deposition (LECD) is a cost-effective technique for fabricating 3D microstructures. In this study, to fabricate a complete n-shaped micro copper structure, multi-layer deposition was adopted, and the v-groove was removed by an asymmetric trajectory. Thereafter, the merging mechanism of the n-shaped structure was analyzed using COMSOL simulations. The results demonstrated that multilayer deposition was suitable for connecting the copper column in different directions; the optimized layer was 15 layers with a height of 15 μm. The simulation showed that the v-groove was caused by the speed difference between the column and bumps, and an asymmetric trajectory with a height difference of 55 μm could suppress vertical deposition and remove the v-groove.
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