Fabrication of an X-shaped micro-copper structure containing a merging joint based on localized electrochemical deposition

Abstract

Local electrochemical deposition (LECD) has proved to be an efficient and economical method for fabricating three-dimensional (3D) micron structures. Realizing complex structures that join up when deposited using LECD has been complex; therefore, the fabrication of an X-shaped joining structure was investigated in this study. A horizontal trace model was proposed, and the effects of the number of deposition layers and the horizontal sweep width on the merging joint were studied. The horizontal trace model could complete the merging joint. Multiple deposition layers and a large horizontal sweep width could stabilize and better connect the X-shaped structure containing merging joints. The merging mechanism of the X-shaped structure was also investigated using COMSOL. The stable deposition of the joining structure enables the LECD method to have a broader range of applications in micro-nano manufacturing.

Fabrication of Cu-Ni Alloy Microcomponents using Localized Electrochemical Deposition

“…Lin et al 11 utilized a deposition-detection-withdrawal strategy to improve the geometric consistency and internal densification of the deposited copper microcolumn. Wang et al 12 proposed a novel micro-anode horizontal trajectory model to facilitate the deposition of X-shaped interconnections using the LECD method. In order to investigate the impact of electrolyte composition on the LECD process, researchers have conducted extensive studies.…”