A highly descriptive method for displaying heat flow in power modules is presented. Heat flow is studied for three different transistor stack types: Direct Bond Copper (DBC), Thick Film Printed Substrate,and Insulated Metal Substrate (IMS). DBC and thick film are thermally superior to IMS, but IMS shows potential. Inaddition,the effectof case-to-sink interface conductivityonheat flow is studied.
This work is a brief comparison of the three different packaging technologies. Flux plots are used to diagnose the thermal problems of existing designs and to give credence to the superiority of the novel designs. The designs presented here make better thermal use of the materials in the power module stack to achieve better performance.
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