In this work we demonstrate germanium loss from uncapped substrates during low temperature drive-in annealing in inert ambient. An Arrhenius law with an activation energy of 2.03 eV describes the measured loss rate of germanium as a function of temperature. Accurate simulations of implanted phosphorous profiles in nonpassivated substrates have been performed considering the extracted germanium loss rate. A capping layer on the germanium surface reduces phosphorous dose loss, with Si3N4 being more efficient than SiO2. The capping layer material also affects the extent of dopant concentration-dependent diffusion for high dose phosphorous implantation.

We report measurement of the silicon diffusion coefficient in silicon dioxide films using isotopically enriched Si28 silicon dioxide layers that enable relatively low Si30 concentration measurements to be performed using secondary ion mass spectrometry. Two types of experiments are made. Si30 atoms are introduced in excess in a stoichiometric isotopically pure silicon dioxide layer either by ion implantation or by a predeposition technique. These experiments are representative of any physical situation in which excess silicon atoms are introduced into silicon dioxide layers during silicon processing. The estimated diffusivity values are significantly higher than previously reported values for Si diffusion within a stoichiometric oxide and closer to reported values for excess Si diffusion within an oxide. The activation energy of the diffusivity is found to be 4.74 eV.

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