The procedure for properly implementing OPC for a new technology node or chip design involves multiple steps: selection of the RET (resolution enhance technique), selection of design rules, OPC Model Building, OPC Verification, CD control quantification (across chip, reticle, wafer, focus, exposure, etc) , calibration of Optical Rule Checks (ORC), and other verification steps. Many of these steps require up to thousands of wafer measurements, and while state-of-the-art CD-SEM tools provide automated metrology for production, manually creating a CD recipe with thousands of unique sites is extremely tedious and error-prone. This places a practical limit on both the quality and number of measurements that can be acquired during the technology development and qualification period. At the same time, the number of measurements required to qualify a new reticle design has increased drastically due to the growing complexity of RET and diminishing tolerances.To meet this challenge, a direct and automated link from the design systems to the process metrology tools is needed. Novel methodologies must also be developed to enable automated generation of the recipe from the design inputs and to translate the flood of metrology results into information that can improve the design, mask data processing, or the patterning process. To facilitate this two-way data flow, a new framework has been created enabling true Design-Based Metrology (DBM), and an application named OPC-Check has been developed to operate within this framework. This DBM framework provides the common language and interface that facilitates the direct transfer of desired measurement locations from the design to the metrology tool. This link is a critical element in Design for Manufacturability (DFM) efforts, a central theme in many presentations at Microlithography 2005. This article discusses the significant benefits of the tight integration of design and process metrology for OPC implementation in a new technology node, and provides some examples of the novel OPC-Check application as currently implemented at AMD SDC with Applied Materials CD-SEM tools.Below lOOnm, shrinking device geometries have placed tremendous pressure on optical lithography and mask technologies to effectively manage the patterning process, even with significant increases in numerical aperture (NA) and decreases in wavelength. This loss of resolving power, seen as diminished pattern printing capability on the wafer, has forced the semiconductor industry to use more aggressive scanner illumination strategies such as annular, quasar, and now dipole illumination conditions (ref I. Matthew, C. Tabery SPIE2005 ). In addition, multiple process layers are also using phase shift masks to maintain resolution as critical features shrink in size.
An algorithm class called CaTH (Centering and Tail Handling) is described that is based on predictive coding followed by adaptive binary arithmetic coding. CaTH treats the prediction errors close to zero (i.e., near the center of the error distribution) in a more precise manner than the errors of the "tails" (i.e., errors far from zero). The context model uses error buckets (quantized ranges) of prediction errors. The probability model for the prediction errors uses a histogram for the center. A variety of ways to binarize the tails are studied. The results on the suite of JPEG test images are very encouraging.
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