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Solar cell efficiencies of 18.2 and 17.8% were achieved on edge-defined film-fed grown and string ribbon multicrystalline silicon, respectively. Improved understanding and hydrogenation of defects in ribbon materials contributed to the significant increase in bulk lifetime from 1–5 μs to as high as 90–100 μs during cell processing. It was found that SiNx-induced defect hydrogenation in these ribbon materials takes place within one second at 740–750 °C. The bulk lifetime decreases at annealing temperatures above 750 °C or annealing times above one second due to the enhanced dissociation of the hydrogenated defects coupled with the decrease in hydrogen supply from the SiNx film deposited by plasma enhanced chemical vapor deposition.

We deposited plasma-enhanced chemical vapor deposition silicon carbon nitride ͑SiC x N y ͒ antireflection coating and passivation layers using a silane-free process. We used a solid polymer source developed at SiXtron Advanced Materials to eliminate the storage and handling of dangerous pyrophoric silane gas. We used ammonia flow rate as a control for the chemical and optical properties in the silane-free process. As NH 3 flow rate increases, the carbon content, refractive index, extinction coefficient, and surface charge density of the film decrease. At an ammonia flow rate of 3000 sccm, which is similar to the conventional SiN x , the extinction coefficients for the two films were similar. This led to an emitter dark saturation current density ͑J oe ͒ of 404 fA/cm 2 for the two films on 45 ⍀/ᮀ emitters. However, a stack passivation of SiO 2 /SiC x N y on an 80 ⍀/ᮀ emitter resulted in an emitter dark saturation current density of 95 fA/cm 2 , which is enough to provide a good surface passivation for high efficiency solar cells. An energy conversion efficiency of 17.4% was obtained for a 149 cm 2 textured Czochralski screen-printed solar cell with this stack passivation. For a 156 cm 2 nontextured multicrystalline silicon, with only SiC x N y and a 45 ⍀/ᮀ emitter, we obtained 14.9% efficiency.

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A boron diffusion process using boric acid as a low cost, nontoxic spin-on source is introduced. Using dilute solutions of boric acid, sheet resistances ranging from 20 to 200Ω/◻ were achieved, along with saturation current densities as low as 85fA/cm2 . These results indicate that boric acid is a suitable source for forming both normalp+ emitters and back surface fields for high efficiency n- and p-type solar cells. The degradation of the minority carrier bulk lifetime, which is a common efficiency-limiting characteristic of low cost boron sources, was also minimized through the use of a high purity boric acid source. The ability to achieve low sheet resistances, high bulk lifetimes and low saturation current densities with boric acid were exploited to achieve a 19.7% efficient screen printed solar cell exhibiting a bulk lifetime 400μs .