We use a glancing-angle deposition technique to produce regular lattices of submicrometer pillars and helices with a two-dimensional lattice constant below 1 m and structure heights of 0.5-10 m. Possible applications of such structures include photonic crystals and magnetic-storage media.
Amorphous-to-crystalline transition during the early stages of thin film growth of Cr on SiO 2 J. Appl. Phys. 93, 9336 (2003); 10.1063/1.1571214Three-dimensional simulation of film microstructure produced by glancing angle deposition It has been shown that glancing angle deposition ͑GLAD͒ coupled with a prefabricated seed layer can be used to fabricate periodic microstructures. In this article, we show that the column competition effects inherent within aperiodic GLAD films can be delayed in periodic films due to the tendency of the film to achieve a preferred density at a given flux incidence angle. This technique, coupled with the use of the three-dimensional ballistic simulator, may allow for the design and use of periodic GLAD microstructures in such applications as magnetic pillars and three-dimensional photonic crystals.
The ABCD3TA is a 128-channel ASIC with binary architecture for the readout of silicon strip particle detectors in the Semiconductor Tracker of the ATLAS experiment at the Large Hadron Collider (LHC). The chip comprises fast front-end and amplitude discriminator circuits using bipolar devices, a binary pipeline for first level trigger latency, a second level derandomising buffer and data compression circuitry based on CMOS devices. It has been designed and fabricated in a BiCMOS radiation resistant process. Extensive testing of the ABCD3TA chips assembled into detector modules show that the design meets the specifications and maintains the required performance after irradiation up to a total ionising dose of 10 Mrad and a 1-MeV neutron equivalent fluence of 2×1014 n/cm2, corresponding to 10 years of operation of the LHC at its design luminosity. Wafer screening and quality assurance procedures have been developed and implemented in large volume production to ensure that the chips assembled into modules meet the rigorous acceptance criteria
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