A novel and highly sensitive disposable glucose sensor strip was developed using direct laser engraved graphene (DLEG) decorated with pulse deposited copper nanocubes (CuNCs). The high reproducibility (96.8%), stability (97.4%) and low cost demonstrated by this 3-step fabrication method indicates that it could be used for high volume manufacturing of disposable glucose strips. The fabrication method also allows for a high degree of flexibility, allowing for control of the electrode size, design, and functionalization method. Additionally, the excellent selectivity and sensitivity (4,532.2 μA/mM.cm2), low detection limit (250 nM), and suitable linear range of 25 μM–4 mM, suggests that these sensors may be a great potential platform for glucose detection within the physiological range for tear, saliva, and/or sweat.

A rapid prototyping of an inexpensive, disposable graphene and copper nanocomposite sensor strip using polymeric flexible substrate for highly sensitive and selective nonenzymatic glucose detection has been developed and tested for direct oxidization of glucose. The CuNPs were electrochemically deposited on to the graphene sheets to improve electron transfer rates and to enhance electrocatalytic activity toward glucose. The graphene based electrode with CuNPs demonstrated a high degree of sensitivity (1101.3±56 μA/mM.cm2), excellent selectivity (without an interference with Ascorbic Acid, Uric Acid, Dopamine, and Acetaminophen), good stability with a linear response to glucose ranging from 0.1 mM to 0.6 mM concentration, and detection limits of 0.025 mM to 0.9 mM. Characterization of the electrodes was performed by scanning electron microscopy (FESEM and SEM). The electrochemical properties of the modified graphene electrodes were inspected by cyclic voltammetry (CV), electrochemical impedance spectroscopy (EIS), and amperometry.

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Tempered martensitic Type 403 stainless steel has been found to suffer pitting corrosion and intergranular stress corrosion cracking in 0.01 M Na2SO4 at temperatures of 75 and 100 C, but not at the lower temperatures of 25 and 50 C. Significant sulfur (sulfate) contamination of the passive film from solution was found, but the level of contamination could not be correlated with the susceptibility of the alloy to IGSCC. Nonmetallic inclusions (MnS) and carbide precipitates were found to act as nucleation sites for corrosion pits which in turn give rise to IGSCC.

Void evolution during electromigration was studied by recording void nucleation, growth, and displacements at various intervals during thermal (240°C) and electrical stress tests (2 × 10 6 amps/cm 2 ) of Cu interconnects. Structural data was collected for various serially arranged line segment lengths and correlated with resistance and increases in resistance due to electromigration-induced thinning and voiding. These results allowed determination of void growth rates in Cu interconnects. Void nucleation and growth show a clear dependence on segment length. Void formation did not occur at the via/interconnect interface, which improved interconnect reliability by allowing extensive voiding before catastrophic failure.