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Ferroelectric, piezoelectric thin film material and processes are gaining more and more importance for innovative devices that are focusing on miniaturization, high performance and integration. A piezoelectric thin film MEMs platform has been developed that enables miniaturized ultrasound transducers that operate in the frequency range of >50 kHz up to >10 MHz. The thin film ultrasound transducers show a high quality and reliability. With this technology platform ultrasound transducers have been developed that operate at 60-90 kHz and show a coverage >25 m 2 at a low operating voltage of 12 V. The same technology platform has been used to realize ultrasound transducer arrays operating at 3-10 MHz. Ultrasound images have been demonstrated with these piezoelectric thin film transducer arrays.

Dielectric, ferroelectric and piezoelectric thin films are getting more and more attention for next generation mobile communication and medical systems. Thin film technologies based on dielectric, ferroelectric and piezoelectric thin films enable System-in-Package (SiP) devices, resulting in optimal integration of various functions in one module with respect to high performance, small size and low cost. Within Philips a passive integration platform for SiP technologies is developed, comprising key functions such as RF filters, micro-electromechanical switches, high-value capacitors as well as passive and active functions integrated in small modules. The piezoelectric thin film technologies do not only play a role for RF filters, but are also a breakthrough technology for a new class of thin film ultrasonic transducers.