The solid-state transformation phenomena of spinodal decomposition and nucleation and growth are presented as tools to create nanostructured thermoelectric materials with very low thermal conductivity and greatly enhanced figure of merit. The systems (PbTe)(1-x)(PbS)(x) and (Pb(0.95)Sn(0.05)Te)(1-x)(PbS)(x) are not solid solutions but phase separate into PbTe-rich and PbS-rich regions to produce coherent nanoscale heterogeneities that severely depress the lattice thermal conductivity. For x > approximately 0.03 the materials are ordered on three submicrometer length scales. Transmission electron microscopy reveals both spinodal decomposition and nucleation and growth phenomena the relative magnitude of which varies with x. We show that the (Pb(0.95)Sn(0.05)Te)(1-x)(PbS)(x) system, despite its nanostructured nature, maintains a high electron mobility (>100 cm(2)/V x s at 700 K). At x approximately 0.08 the material achieves a very low room-temperature lattice thermal conductivity of approximately 0.4 W/m x K. This value is only 28% of the PbTe lattice thermal conductivity at room temperature. The inhibition of heat flow in this system is caused by nanostructure-induced acoustic impedance mismatch between the PbTe-rich and PbS-rich regions. As a result the thermoelectric properties of (Pb(0.95)Sn(0.05)Te)(1-x)(PbS)(x) at x = 0.04, 0.08, and 0.16 were found to be superior to those of PbTe by almost a factor of 2. The relative importance of the two observed modes of nanostructuring, spinodal decomposition and nucleation and growth, in suppressing the thermal conductivity was assessed in this work, and we can conclude that the latter mode seems more effective in doing so. The promise of such a system for high efficiency is highlighted by a ZT approximately 1.50 at 642 K for x approximately 0.08.

This study included a comparison of the baseline Sn-3.5Ag eutectic to one neareutectic ternary alloy, Sn-3.6Ag-1.0Cu and two quaternary alloys, Sn-3.6Ag-1.0Cu-0.15Co and Sn-3.6Ag-1.0Cu-0.45Co, to increase understanding of the beneficial effects of Co on Sn-Ag-Cu solder joints cooled at 1-3∞C/sec, typical of reflow practice. The results indicated that joint microstructure refinement is due to Co-enhanced nucleation of the Cu 6 Sn 5 phase in the solder matrix, as suggested by Auger elemental mapping and calorimetric measurements. The Co also reduced intermetallic interface faceting and improved the ability of the solder joint samples to maintain their shear strength after aging for 72 hr at 150∞C. The baseline Sn-3.5Ag joints exhibited significantly reduced strength and coarser microstructures.

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