Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

Anderson, Iver E.; Foley, Jim; Cook, B. A.; Harringa, J. L.; Terpstra, Robert L; Ünal, Ö.

doi:10.1007/s11664-001-0129-5

Cited by 205 publications

(149 citation statements)

References 10 publications

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“…One approach to controlling melt undercooling is microalloying SAC with a dilute addition of certain fourth elements, and these SAC-X solders (X is the addition element) have been studied for more than a decade [15][16][17][18][19]. It has been found that Co additions are particularly effective at suppressing the nucleation undercooling of βSn [20][21][22][23][24][25][26][27][28][29].…”

Section: The Paper Published In Journal Of Alloys and Compounds In 2016mentioning

confidence: 99%

Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders

Belyakov

Gourlay

2016

Journal of Alloys and Compounds

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We show that cobalt-microalloying causes significant grain refinement in large samples (60g) of Sn-3Ag-0.5Cu solder. Nucleation occurs on the (100) facet of CoSn 3 crystals with a reproducible orientation relationship of (100) ∥ (100) withwhich has a planar lattice mismatch of ~4%. In 550m solder joints on Cu substrates, Co microalloying alters the Sn nucleation location to an CoSn 3 particle in the bulk liquid and increases the number of Sn nucleation events when the cooling rate is higher than ~5 K/s.However, Co-microalloying caused only weak grain refinement in sample volumes relevant to solder joints which is explained using nucleation and grain refinement theories.

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Section: The Paper Published In Journal Of Alloys and Compounds In 2016mentioning

confidence: 99%

Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders

Belyakov

Gourlay

2016

Journal of Alloys and Compounds

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“…This form is dispersed thoroughly in the bulk alloy. 5,8 Due to the small size of these oxides, they have not been determined exactly.…”

Section: Particle Sizementioning

confidence: 99%

“…[5][6][7][8][9][10] They are widely used in Sn-Zn, Sn-Ag, and Ag-Cu alloys. [6][7][8] Lanthanum (La) is considered as a good additive due to its lower cost, wide availability, and low melting point 4 as compared with other RE elements.…”

Section: Introductionmentioning

confidence: 99%

Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders

Sadiq

Pesci

Cherkaoui

2013

Journal of Elec Materi

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is an open access repository that collects the work of Arts et Métiers ParisTech researchers and makes it freely available over the web where possible. An extensive study is made to analyze the impact of pure lanthanum on the microstructure and mechanical properties of Sn-Ag-Cu (SAC) alloys at high temperatures. Different compositions are tested; the temperature applied for the isothermal aging is 150°C, and aging times of 10 h, 25 h, 50 h, 100 h, and 200 h are studied. Optical microscopy with cross-polarized light is used to follow the grain size, which is refined from 8 mm to 1 mm for as-cast samples and is maintained during thermal aging. Intermetallic compounds (IMCs) present inside the bulk Sn matrix affect the mechanical properties of the SAC alloys. Due to high-temperature exposure, these IMCs grow and hence their impact on mechanical properties becomes more significant. This growth is followed by scanning electron microscopy, and energy-dispersive spectroscopy is used for elemental mapping of each phase. A significant refinement in the average size of IMCs of up to 40% is identified for the as-cast samples, and the coarsening rate of these IMCs is slowed by up to 70% with no change in the interparticle spacing. Yield stress and tensile strength are determined through tensile testing at 20°C for as-cast samples and after thermal aging at 150°C for 100 h and 200 h. Both yield stress and tensile strength are increased by up to 20% by minute lanthanum doping.

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“…Among several candidate Pb-free alloy systems, the nearternary-eutectic Sn-Ag-Cu alloys with a melting temperature around 217 C are becoming a leading candidate, [1][2][3] especially for SMT card assembly including BGA solder joints. The near-eutectic, commercially available alloys include Sn-4.0Ag-0.5Cu, Sn-3.9Ag-0.6Cu, Sn-3.8Ag-0.7Cu, and Sn-3.0Ag-0.5Cu (in mass%).…”

Section: Near Ternary Eutectic Sn-ag-cu Alloysmentioning

confidence: 99%

The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints

et al. 2004

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The electronic industry is making substantial progress toward a full transition to Pb-free soldering in the near future. At present, the leading candidate Pb-free solders are near-ternary eutectic Sn-Ag-Cu alloys. The electronic industry has begun to study both the processing behaviors and the thermo-mechanical fatigue properties of these alloys in detail in order to understand their applicability in context of current electronic card reliability requirements. In recent publications, the solidification behavior of the near-ternary eutectic Sn-Ag-Cu alloys has been reported in terms of the formation of large Ag 3 Sn plates and their effects on mechanical properties of Pb-free solder joints. Several methods have been employed to minimize the growth of the large Ag 3 Sn plates in the Sn-Ag-Cu solder joints by controlling the cooling rate during solidification, reducing Ag and/or Cu content, or adding minor alloying elements which reduce the amount of undercooling required for the nucleation of tin dendrites. In the present study, the results of accelerated thermal cycle fatigue tests are reported with the near-ternary eutectic Sn-Ag-Cu alloys of reduced Ag contents. Changes in microstructure and mechanical properties are also discussed by comparing the solder joints before and after thermal cycling.

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Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

Cited by 205 publications

References 10 publications

Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders

Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders

Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders

The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints

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