Lightweight high-density polyethylene (HDPE)-graphene nanoplatelet (GnP) composite foams were fabricated via a supercritical-fluid (SCF) treatment and physical foaming in an injection-molding process. We demonstrated that the introduction of a microcellular structure can substantially increase the electrical conductivity and can decrease the percolation threshold of the polymer-GnP composites. The nanocomposite foams had a significantly higher electrical conductivity, a higher dielectric constant, a higher electromagnetic interference (EMI) shielding effectiveness (SE), and a lower percolation threshold compared to their regular injection-molded counterparts. The SCF treatment and foaming exfoliated the GnPs in situ during the fabrication process. This process also changed the GnP's flow-induced arrangement by reducing the melt viscosity and cellular growth. Moreover, the generation of a cellular structure rearranged the GnPs to be mainly perpendicular to the radial direction of the bubble growth. This enhanced the GnP's interconnectivity and produced a unique GnP arrangement around the cells. Therefore, the through-plane conductivity increased up to a maximum of 9 orders of magnitude and the percolation threshold decreased by up to 62%. The lightweight injection-molded nanocomposite foams of 9.8 vol % GnP exhibited a real permittivity of ε' = 106.4, which was superior to that of their regular injection-molded (ε' = 6.2). A maximum K-band EMI SE of 31.6 dB was achieved in HDPE-19 vol % GnP composite foams, which was 45% higher than that of the solid counterpart. In addition, the physical foaming reduced the density of the HDPE-GnP foams by up to 26%. Therefore, the fabricated polymer-GnP nanocomposite foams in this study pointed toward the further development of lightweight and conductive polymer-GnP composites with tailored properties.

Ideal dielectric materials for microelectronic devices should have high directionally tailored thermoconductivity with low dielectric constant and loss. Hexagonal boron nitride (hBN) with excellent thermal and dielectric properties shows a promise for the fabrication of thermoconductive dielectric polymer composites. Herein, a simple method for the fabrication of lightweight polymer/hBN composites with high directionally tailored thermoconductivity and excellent dielectric properties is presented. The solid polymer/hBN composites are manufactured by melt-compounding and injection molding. The porous composites are successfully manufactured in an injection molding process through supercritical fluid (SCF) foaming. X-ray tomography provides direct visualization of the internal microstructure and hBN orientation, leading to an in-depth understanding of the directionally dependent thermoconductivity of the polymer/hBN composite. Shear-induced orientation of hBN platelets in the solid HDPE/hBN composites leads to a significant anisotropic thermal conductivity. The solid HDPE/23.2 vol % hBN composites show an in-plane thermoconductivity as high as 10.1 W m–1 K–1, whereas the through-plane thermoconductivity is limited to 0.28 W m–1 K–1. However, the generation of a porous structure via SCF foaming imparts in situ exfoliation, random orientation, and interconnectivity of hBN platelets within the polymer matrix. This results in highly isotropic thermoconductivity with higher bulk thermal conductivity in the lightweight porous composites as compared to their solid counterparts. Furthermore, the electrically insulating composites developed in this study exhibit low dielectric constant and ultralow dielectric loss. Thus, this study presents a simple fabrication method to develop lightweight dielectric materials with tailored thermal conductivity for modern electronics.

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This article discusses contact electrification and related electrostatic forces as they pertain to the adhesive properties of gecko foot pads and gecko‐inspired adhesives. Following an introduction to gecko adhesion and gecko‐inspired adhesives, fundamentals of contact electrification‐driven electrostatic interactions are discussed, along with electrostatic phenomena that can affect these interfacial interactions. Particular attention has been given to three special phenomena: electrostatic discharge, surface charge leakage, and charge penetration into the matrix of fibrillar dry adhesives. Through the analysis of the effects of these three phenomena, it is demonstrated how the general characteristics of fibrillar dry adhesives, such as strong attachment, easy detachment, and self‐cleaning, can be considered and explained in terms of contact electrification‐driven electrostatic interactions of these materials. In this connection, the effects of many factors (electrical conductivity, dielectric properties, and geometrical properties) on contact electrification‐driven electrostatic interactions of fibrillar dry adhesives have also been discussed. The ensuing discussion on the magnitude of electrostatic adhesion forces that fibrillar dry adhesives can develop via contact electrification has been carried out with respect to three key parameters (surface roughness, humidity, and tip geometry) and the effects that these can have on the strength of the contact electrification‐driven electrostatic interactions of gecko and gecko‐inspired adhesives.