Best-first search is a widely used problem solving technique in the field of artificial intelligence. The method has useful applications in operations research as well. Here we describe an application to constrained two-dimensional cutting stock problems of the following type: A stock rectangle S of dimensions (L, W) is supplied. There are n types of demanded rectangles r1, r2, …, rn, with the ith type having length li, width wi, value vi, and demand constraint bi. It is required to produce, from the stock rectangle S, ai copies of ri, 1 ≤ i ≤ n, to maximize a1v1 + a2v2 + · + anvn subject to the constraints ai ≤ bi. Only orthogonal guillotine cuts are permitted. All parameters are integers. A best-first tree search algorithm based on Wang's bottom-up approach is described that guarantees optimal solutions and is more efficient than existing methods.
A novel testing technique has been developed capable of measuring the interfacial fracture resistance, Γi, of thin ductile films on substrates. In this technique, the thin film on the substrate is stressed by depositing onto the film a second superlayer of material, having a large intrinsic stress, such as Cr. Subsequent processing defines a precrack at the interface between the film and the substrate. The strain energy available for driving the debond crack is modulated by varying the thickness of the Cr superlayer. Spontaneous decohesion occurs for superlayers exceeding a critical thickness. The latter is used to obtain Γi from elasticity solutions for residually stressed thin films. The technique has been demonstrated for Cu thin films on silica substrates.
Abstract. The intent of this review is to utilize the mechanics of thin films in order to define quantitative procedures for predicting interface decohesion motivated by residual stress. The emphasis is on the role of the interface debond energy, especially methods for measuring this parameter in an accurate and reliable manner. Experimental results for metal films on dielectric substrates are reviewed and possible mechanisms are discussed.
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